Motorola Corporation

Dwight L Daniels

Jeffrey Alan Miks

Dilip D Patel

James H Knapp

Treliant Fang

Brian A Webb

Keith E Nelson

Athena M Parmenter

Stephen C St Germain

An optical semiconductor component includes a semiconductor substrate (,) and a packaging material (,) located over the semiconductor substrate. The packaging material includes an optically transparent cycloaliphatic polymer (,). A method of manufacturing the component includes nixing a monomer (,) of the polymer with a catalyst to form the packaging material, filtering the packaging material, applying the packaging material, and curing the packaging material.

Optical semiconductor component and method of manufacture

An electronic component assembly (,) is formed by mounting an electronic component (,) to the leads (,) of a leadframe (,). The portions of the leadframe (,) that come in physical contact with the electronic component (,) are electrically connected to the electronic component with bonding wires (,) or by placing the bonding regions (,) of the electronic component (,) in direct physical contact with the tips (,) of the leads (,). A package (,) is used to encapsulate the leads (,) and the electronic component (,).

Electronic component assembly and method of making the same

A transport head (10) and a method for transporting flux and solder balls (50) to locations for bonding pads (46) on a workpiece (44). To transfer flux, a first pattern definition mask (12) is attached to the transport head (10) and allows selector pins (64) to fully extend and receive flux for transport to the bonding pads (46) on the substrate (44). To transfer the solder balls (50), pattern definition mask (12) attached to the transport head (10) defines locations that are to be populated with the solder balls (50). The transport head (10) transfers the solder balls (50) to the bonding pads (46) of the substrate (44).

Universal transport apparatus

A semiconductor device includes a substrate (10) that can be cut into different sizes. A plurality of wirebond fingers (12) are formed on a top surface (13) of the substrate (10). The plurality of wirebond fingers (12) are located within concentric interconnect regions (23, 25, 27, 29, 31, 33, 35) and electrically connected to a via (14) by a signal interconnect line (11). The size of substrate (10) can be altered by cutting the substrate (10) to remove any of the interconnect regions (23, 25, 27, 29, 31, 33, 35). A semiconductor component (44) attached to the top side (13) of the substrate (10) can have a die pad (48) wirebonded to any of the plurality of wirebond fingers (12) located along the signal interconnect line (11) for connection to the via (14).

Semiconductor device and method of manufacture

A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive interconnects (14) and a semiconductor receiving area (17) on a top surface and solder pads (13) on a bottom surface. An optoelectronic component (24) is mounted on the semiconductor receiving area (17) and encapsulated with the optically transmissive material (29, 31). Solder balls (18) are formed on the solder pads (13).

Ball grid device with optically transmissive coating

An electronic component can be more easily tested after being mounted onto a circuit board (660). The component also stops cracks from propagating over vital areas of a substrate (110). The component includes an electrically insulative substrate (100), electrically conductive traces (120) supported by the electrically insulative substrate (100), and an electrically insulative layer (310) covering inner and outer portions of the electrically conductive traces (120) while middle portions of the electrically conductive traces (120) remain exposed.

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Mesa, AZ, United States of America

Dwight L Daniels