Eastman-kodak Company

Dwight John Petruchik

Mario Joseph Ciminelli

Steven L Moore

Joseph Anthony Manico

Diana C Petranek

R Winfield Trafton

Arthur King Wilson

Mark D Perkins

James J Haflinger

Donald P McGinn

Eric A Merz

Stanley W Stephenson

Dennis R Zander

Kevin M Johnson

Kenneth D Corby

Steven J Dietl

Robert G Capurso

Clay A Dunsmore

John H Alligood

William F Dassero

Marcello D Fiscella

Charles Francis Scaglione

Kevin J O'Leary

Ronald W Grant, Jr

William B Salvas

Andrew Sailus

Dale B Parks

James Edward Vianco, Sr

Bruce John Semmler

Richard L Alfvin

Charles J Bernitt

James M Grady

Daniel J Stark

John M Wolski

James E Vianco, Sr

Ronald D Winegarden

Steven Lee Moore

A method of fabricating a mounting substrate forming an ink inlet in a first layer of a first dielectric; forming contact pads on a second layer of a second dielectric; forming a slot through the second layer; forming a window through a third layer of a third dielectric; aligning and laminating the second layer to the first layer such that the ink inlet is aligned with the slot; and aligning and laminating the third layer to the second layer so the contact pads and the slot are exposed through the window; providing a printhead die having: a drop mechanism for ejecting drops; a chamber to contain ink; and adhesively bonding the printhead die to the second layer so that the printhead die is disposed within the window and an inlet feed opening of the printhead die is aligned with the slot through the second layer.

Fabrication of an inkjet printhead mounting substrate

An inkjet printhead includes a printhead die including: a first nozzle array that is configured to be fed with ink by a first ink feed; and a second nozzle array that is configured to be fed with ink by a second ink feed; and a mounting substrate including: a surface to which the printhead die is attached; a first layer including a first ink channel having an opening disposed at the surface; a second layer including a second ink channel having an opening disposed at the surface; and a third layer disposed between the first layer and the second layer, wherein the printhead die is attached to the first layer, the second layer and the third layer, and wherein the first ink channel opening is fluidically connected to the first ink feed, and the second ink channel opening is fluidically connected to the second ink feed.

Inkjet printhead with layered ceramic mounting substrate

A method of controlling a maintenance operation in an inkjet printer, the method includes detecting that ink supply connection to a printhead has been interrupted; detecting that ink supply connection to the printhead has been restored; measuring a time interval between the interruption and the restoration of the ink supply connection to the printhead; and selecting a level of the maintenance operation, depending upon a length of the time interval.

Printhead maintenance based on ink supply interruption

An inkjet printhead includes a printhead die including: a mounting substrate on which the printhead die is mounted, the mounting substrate including: a base layer including a hole; an intermediate layer including: a first surface including a plurality of contact pads; a second surface opposite the first surface, the second surface being proximate the base layer; and a slot that is aligned with the hole in the base layer; and a face layer proximate the first surface of the intermediate layer, the face layer including a window, wherein the printhead die is disposed within the window such that an ink feed opening of the printhead die is in fluid communication with the slot in the intermediate layer of the mounting substrate; and a plurality of electrical interconnections connecting bond pads of the printhead die to the plurality of contact pads on the intermediate layer of the mounting substrate.

Inkjet printhead with multi-layer mounting substrate

A liquid ejector includes an electrically insulating support having a first surface and a second surface. An electrical trace begins on the first surface of the support and ends on the second surface of the support. An ejector die is positioned on the first surface of the support and electrically connected to the portion of the electrical trace located on the first surface of the support. A polymer material is molded on a portion of the ejector die and at least a portion of the first surface of the support. A portion of the electrical trace remains free of the polymer material.

Metalized printhead substrate overmolded with plastic

The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding.

Injection molded mounting substrate

A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.

Die mounting assembly formed of dissimilar materials

A marking assembly includes a substrate and a marking device. The substrate includes a first portion made from a first material including a plurality of alignment features, and a second portion made from a second material affixed to the first portion of the substrate. The marking device is affixed to the second portion of the substrate and aligned to the alignment features of the first portion of the substrate.

Insert molded printhead substrate

An ink tank having a tank housing; an electrical contact on the housing; an ink outlet port disposed on the housing; and at least one projection disposed adjacent the electrical contact on the housing, wherein the projection is configured for engaging a leaf spring of an inkjet printer. The leaf spring exerts an out and away pivoting force on the projection so that an electrical connection destination for the electrical contact is prevented until the ink tank is completely installed.

Ink tank feature for improved mounting reliability

An inkjet printhead that receives one or more detachably mountable ink tanks, the inkjet printhead includes an ink tank holding receptacle that receives the one or more detachably mountable ink tanks between a first and second wall; a spring disposed on the first wall of the printhead to provide a biasing force in a direction that pushes the detachably mountable ink tank away from the first wall of the printhead and which biasing force must be manually overcome in order to properly install the one or more detachably mountable ink tanks in the ink tank holding receptacle of the printhead.

Printhead with improved ink tank mounting reliability

An inkjet carriage that receives a print cartridge, the inkjet carriage includes a holding receptacle having a wall, wherein the holding receptacle is configured to receive the print cartridge; and a spring disposed on the wall of the holding receptacle to provide a biasing force in a direction that pushes the print cartridge away from the wall of the inkjet carriage and which biasing force must be manually overcome in order to properly install the print cartridge in the holding receptacle of the inkjet carriage.

Carriage with improved print cartridge mounting reliability

The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding. The die-attach portion is made of a material having a low coefficient of thermal expansion along a direction that is parallel to a fluid passageway in the die attach portion.

Fluid ejection assembly having a mounting substrate

Various embodiments of a printing device fluid reservoir with alignment features and various embodiments of a printing device fluid reservoir chassis with alignment features are disclosed. According to some aspects of these embodiments, the alignment features are grouped together near an ultimate connection point between a fluid reservoir and a chassis to increase design freedom on other regions of the fluid reservoir/chassis. Other aspects of these embodiments include specially designed and located alignment features of a fluid reservoir that engage specially designed and located alignment features of a chassis in sequence throughout the process of inserting the fluid reservoir into the chassis in order to facilitate simple and effective engagement.

Growing community of inventors

Honeoye Falls, NY, United States of America

Dwight John Petruchik