Delco Electronics Corporation

Dwadasi Hare Sarma

Marion Edmond Ellis

Christine Ann Paszkiet

Anthony John Stankavich

A high temperature thick-film hybrid circuit is characterized by a surface-mount circuit component that is electrically interconnected with a conductor. The surface-mount circuit component of the thick-film hybrid circuit is bonded to the conductor with a soldering technique employing dual-solder layers. The dual-solder layers enable component attachment to the conductor at a temperature below the maximum processing temperature of the component, while forming a solder joint that exhibits suitable adhesion properties at temperatures in excess of 165.degree. C. The dual-solder layers can be chosen to inhibit tin diffusion from the solder, silver leaching from the conductor, and the formation of a brittle intermetallic at the solder-conductor interface.

Growing community of inventors

Kokomo, IN, United States of America

Dwadasi Hare Sarma