Delphi Technologies, Inc.

Dwadasi Hare Rama Sarma

Carl William Berlin

Bruce Alan Myers

Frans Peter Lautzenhiser

Bradley H Carter

Manuel Ray Fairchild

Rhonda Jean Heytens

Daniel Keith Ward

Kevin J Hawes

John Karl Isenberg

Marion Edmond Ellis

David Jay Vess

Philip Harbaugh Bowles

Anthony John Stankavich

Washington Morris Mobley

Jerome Anthony Schneider

A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions formed by a plurality of first ceramic layers and at least one second ceramic layer, respectively, that are superimposed and bonded to each other. Conductor lines are present on at least some of the first ceramic layers so as to be between adjacent pairs of the layers. Electrically-conductive vias electrically interconnect the conductor lines on different first ceramic layers, and a surface-mount IC device is mounted to the substrate. The first ceramic layers are formed of electrically-nonconductive materials, while the one or more second ceramic layers contain thermally-conductive particles dispersed in a matrix of electrically-nonconductive materials, such that the one or more second ceramic layers are more thermally conductive than the first ceramic layers.

Process of forming a laminate ceramic circuit board

A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions formed by a plurality of first ceramic layers and at least one second ceramic layer, respectively, that are superimposed and bonded to each other. Conductor lines are present on at least some of the first ceramic layers so as to be between adjacent pairs of the layers. Electrically-conductive vias electrically interconnect the conductor lines on different first ceramic layers, and a surface-mount IC device is mounted to the substrate. The first ceramic layers are formed of electrically-nonconductive materials, while the one or more second ceramic layers contain thermally-conductive particles dispersed in a matrix of electrically-non-conductive materials, such that the one or more second ceramic layers are more thermally conductive than the first ceramic layers.

Laminate ceramic circuit board and process therefor

A thick-film paste for printing thick-film circuit elements, including solder stops, conductors, resistors and capacitors, and a method for using the paste. The paste has a composition that includes an organic vehicle, a filler material that contributes the desired electrical and/or material properties to the thick film fired from the paste, and an additive that is insoluble in the organic vehicle and contributes pseudoplastic Theological properties to the paste during printing. The additive also preferably evaporates, burns off, sublimates or is otherwise removed below the firing temperature of the paste.

Thick-film paste with insoluble additive

A hybrid circuit structure that includes a metal substrate, an inorganic electrical insulator layer and at least one inorganic thick-film passive circuit element, such as a thick-film resistor, capacitor or conductor. An interface layer is provided between the insulator layer and the circuit element to prevent the detrimental effects of interlayer diffusion. The composition of the interface layer is selected to prevent the diffusion of constituents from the inorganic insulator layer, and to have a CTE near that of the circuit element to reduce thermal fatigue. As a result, the passive circuit element can be formed of essentially any one of a number of conventional inorganic thick-film materials that are widely used on alumina substrates.

Method of forming thick-film hybrid circuit on a metal circuit board

A method by which a conventional circuit trace (,) is modified with a layer (,) of high-conductivity solder alloy to yield a high-current circuit trace (,) for high-current routing on a substrate (,). The method generally entails the use of a solder composition that contains a dispersion of metal particles (,) in a solder alloy (,). The metal particles (,) are selected on the basis of having a higher electrical conductivity than the solder alloy (,), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (,). The solder composition is deposited on a conductor (,), and then reflowed to form a conductive layer (,) on the conductor (,). The metal particles (,) remain as a discrete dispersion within the conductive layer (,) in order to suitably promote the conductivity of the layer (,). The solder composition is preferably deposited in an amount sufficient to increase the current-carrying capacity of the resulting circuit trace (,) for high-current routing on the substrate (,), e.g., in excess of six amps.

High-current circuit trace and composition and method therefor

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Kokomo, IN, United States of America

Dwadasi Hare Rama Sarma