Kopin Corporation

Other

Duy-Phach Vu

Brenda D Dingle

Ngwe K Cheong

Paul M Zavracky

Jason E Dingle

Matthew M Zavracky

Mark B Spitzer

Lisa P Allen

John C Fan

Jagdish Narayan

Jeffrey Jay Jacobsen

Jack P Salerno

Quoc-Bao Vu

Richard H Morrision, Jr

Michael W Batty

The invention relates to the formation of thin-film crystalline silicon using a zone-melting recrystallization process in which the substrate is a ceramic material. Integrated circuits and solar cells are fabricated in the recrystallized silicon thin film and lifted off the substrate. Following lift-off, these circuits and devices are self-sustained, lightweight and flexible and the released ceramic substrate can be reused making the device fabrication process cost effective.

Method for production of thin semiconductor solar cells and integrated circuits

The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.

Method of forming an active matrix display

The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.

High density electronic circuit modules

A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.

Three dimensional processor using transferred thin film circuits

The present invention relates to methods of fabricating pixel electrodes ( ) for active matrix displays including the formation of arrays of transistor circuits in thin film silicon ( ) on an insulating substrate and transfer of this active matrix circuit onto an optically transmissive substrate ( ). An array of color filter elements can be formed prior to transfer of the active matrix circuit that are aligned between a light source for the display and the array of pixel electrodes to provide a color display.

Methods of fabricating active matrix pixel electrodes

Method for manufacturing active matrix liquid crystal displays

Bonded layer semiconductor device

Integrated circuits for use in electronic devices requiring high density packaging are fabricated to provide highly flexible and ultra-thin devices having a variety of applications. The flexible circuits have dimensions up to several centimeters in surface area and thicknesses of a few microns. These circuits are fabricated using transfer techniques which include the removal of VLSI circuits from silicon wafers and mounting of the circuits on application specific substrates.

Transferred flexible integrated circuit

Single crystal silicon tiles for display panels

The present invention relates to methods of fabricating pixel electrodes for active matrix displays including the formation of arrays of transistor circuits in thin film silicon on an insulating substrate and transfer of this active matrix circuit onto an optically transmissive substrate. An array of color filter elements can be formed prior to transfer of the active matrix circuit that are aligned between a light source for the display and the array of pixel electrodes to provide a color display.

Process of fabricating active matrix pixel electrodes

Method for forming three dimensional processor using transferred thin

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Taunton, MA, United States of America

Duy-Phach Vu