Apple Inc.

Duy P Le

Christopher Kuh

Guillaume Raoult

Robert D Brunner

Robert A Boyd

Christopher Wiita

Elvin Chu

Vijay Karthik Koneru

Sean S Corbin

Jeffrey Scott Croyle

Matthew Vincent Costello

Matthew Phillip Casebolt

Martin Gschwandtl

Christina J Smiechowski

James Swasey

Ryan Ott

Michael Benjamin Wittenberg

Matthew D Hill

Joseph F Dembs

Shane Bustle

Kjell Ferdinand Ekman

Zu-Ning Chen

Carlos M Santana

Wenjie Zhuang

Hamish S Thain

Bart Jansen

Megan J Burmeister

Michael Rodriguez

John R Bruss

Burak Metin

Eugene Antony Whang

Shota Aoyagi

Sawyer Isaac Cohen

Lucy Elizabeth Browning

George Tziviskos

Benjamin Shane Bustle

Dustin A Hatfield

Ming Li

Masashige Tatebe

Takahiro Oshima

Thomas Johannessen

Hailong Wang

Shi Hua Zhang

Andrew J Meschke

Logan M Ames

David J Feathers

Michael W Barnstead

Yi-Fang D Tsai

Yufan Liao

Matthew D Walker

Ricky C Lee

Sean A Backs

Peter M Pavlov

Richard M Bretherton

Junjie Xu

Earphone

Earphones

Case with earphones

Case

Portable ear-worn acoustic devices having a wingtip anchor for improved anchoring for active users and to accommodate a wide range of ear sizes and shapes are provided herein. Such acoustic devices an include an earbud device body and a wingtip anchor that extends from an outer face of the device body. The wingtip anchor can include a base portion and a protruding portion that extends upwards and is angled or curved inwardly so as to engage the upper concha of the ear. The wingtip anchor can be flexible so that engagement of a distal portion of the anchor exerts an inwardly directed spring force on the device body to maintain the earbud device body within the ear. Such acoustic devices can further include a multi-function button that is integrated with the wingtip anchor such that the base portion of the wingtip anchor is a faceplate for the multi-function button.

Audio device with wingtip anchor

A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

Coupling structures for electronic device housings

Pair of earphones

Growing community of inventors

Los Angeles, CA, United States of America

Duy P Le