Micron Technology Incorporated

Intel Corporation

Sony Corporation

Sony Semiconductor Solutions Corporation

Round Rock Research, LLC

Micro Technology, Inc.

Durai Vishak Nirmal Ramaswamy

Kamal M Karda

Scott E Sills

Gurtej S Sandhu

Haitao Liu

Kirk D Prall

Karthik Sarpatwari

Ashonita A Chavan

Alessandro Calderoni

Beth R Cook

Qian Tao

Wayne I Kinney

Adam D Johnson

Yongjun Jeff Hu

Eric Blomiley

Matthew N Rocklein

Cem Basceri

Ramanathan Gandhi

Noel Rocklein

Kyu S Min

Lei Bi

Rhett T Brewer

F Daniel Gealy

Christopher W Petz

Sameer Chhajed

Richard Edward Fackenthal

Sanh D Tang

Dale Collins

Manuj Nahar

Chandra V Mouli

Martin F Schubert

Joel A Drewes

Xiaonan Chen

Yi Fang Lee

Muralikrishnan Balakrishnan

Brent Keeth

Ferdinando Bedeschi

Fatma Arzum Simsek-Ege

Thomas M Graettinger

Everett Allen McTeer

Srinivas Pulugurtha

Alessandro Torsi

Tsz Wah Chan

Ronald Allen Weimer

Allen McTeer

Tomohito Tsushima

Swapnil Lengade

Shuichiro Yasuda

Shu Qin

Duane R Mills

Jun Sumino

Eric S Carman

Wataru Otsuka

Takafumi Kunihiro

Jonathan J Strand

Michael Mutch

Marco Domenico Tiburzi

Mark S Korber

Bei Wang

Kevin J Ryan

Chris M Carlson

Makoto Kitagawa

Marcello Mariani

Giorgio Servalli

Yunfei Gao

Venkatesan Ananthan

Ron Weimer

Robert Quinn

Tejas Krishnamohan

Tom Graettinger

Arup Bhattacharyya

Eugene P Marsh

Akira Goda

Garo Jacques Derderian

John K Zahurak

David H Wells

John A Smythe

Ravi T Iyer

Mark Fischer

Bhaskar Srinivasan

Hong Li

Ross S Dando

Vassil N Antonov

Wayne H Huang

Jaydeb Goswami

Christian Caillat

Albert Liao

Luca Fumagalli

Ian C Laboriante

Kentaro Ishii

Marko Milojevic

Lance Williamson

Kamal Kumar Muthukrishnan

Clement Jacob

Amirhasan Nourbakhsh

Krishna Kumar Parat

Angelo Visconti

Deepak Chandra Pandey

Danny Dynka

Some embodiments include apparatuses and methods of using the apparatuses. One of the apparatuses includes first, second, and third conductive structures, each having a length in a first direction, first and second memory cells spaced apart from each other in a second direction perpendicular to the first direction, first conductive regions, and second conductive regions. Each of the first and second memory cells includes a first semiconductor portion located on a first level of the apparatus and coupled to the third conductive structure and one of the first and second conductive structures, a second semiconductor portion located on a second level of the apparatus and coupled to one of the first and second conductive structures. The first conductive regions are opposite the first and second semiconductor portions, respectively, of the first memory cell. Second conductive regions are opposite the first and second semiconductor portions, respectively, of the second memory cell.

Memory device having tiers of 2-transistor memory cells

Some embodiments include a ferroelectric transistor having a first electrode and a second electrode. The second electrode is offset from the first electrode by an active region. A transistor gate is along a portion of the active region. The active region includes a first source/drain region adjacent the first electrode, a second source/drain region adjacent the second electrode, and a body region between the first and second source/drain regions. The body region includes a gated channel region adjacent the transistor gate. The active region includes at least one barrier between the second electrode and the gated channel region which is permeable to electrons but not to holes. Ferroelectric material is between the transistor gate and the gated channel region.

Ferroelectric transistors and assemblies comprising ferroelectric transistors

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a first data line, a second data line, a conductive line, and a memory cell coupled to the first and second data lines. The memory cell includes a first transistor and a second transistor. The first transistor includes a first region electrically coupled to the first and second data lines, and charge storage structure electrically separated from the first region. The second transistor includes a second region electrically separated from the first region, the second region electrically coupled to the charge storage structure and the second data line. The conductive line is electrically separated from the first and second channel regions. Part of the conductive line is spanning across part of the first region of the first transistor and part of the second region of the second transistor.

Memory device having shared read/write data line for 2-transistor vertical memory cell

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a first data line located in a first level of the apparatus; a second data line located in a second level of the apparatus; a first memory cell located in a third level of the apparatus between the first and second levels, the first memory cell including a first transistor coupled to the first data line, and a second transistor coupled between the first data line and a charge storage structure of the first transistor; and a second memory cell located in a fourth level of the apparatus between the first and second levels, the second memory cell including a third transistor coupled to the second data line, and a fourth transistor coupled between the second data line and a charge storage structure of the third transistor, the first transistor coupled in series with the third transistor between the first and second data lines.

Memory device having 2-transistor vertical memory cell and shared channel region

Methods, systems, and devices for differential storage in memory arrays are described. A memory device may include pairs of memory cells configured to store a single logic state (e.g., a single bit of information). Additionally, the memory device may include sense amplifiers configured to sense the logic state based on a difference between a voltage of a first ferroelectric memory cell of the pair of memory cells and a voltage of a second ferroelectric memory cell of the pair of memory cells. In one example, the memory device may include pairs of memory cells within a single memory array on a single level. Here, each memory cell pair may include a memory cells that are each coupled with a same word line and plate line. Additionally, each memory cell pair may include memory cells each coupled with different digit lines.

Differential storage in memory arrays

Some embodiments include integrated memory having an array of access transistors. Each access transistor includes an active region which has a first source/drain region, a second source/drain region and a channel region. The active regions of the access transistors include semiconductor material having elements selected from Groups 13 and 16 of the periodic table. First conductive structures extend along rows of the array and have gating segments adjacent the channel regions of the access transistors. Heterogenous insulative regions are between the gating segments and the channel regions. Second conductive structures extend along columns of the array, and are electrically coupled with the first source/drain regions. Storage-elements are electrically coupled with the second source/drain regions. Some embodiments include a transistor having a semiconductor oxide channel material. A conductive gate material is adjacent to the channel material. A heterogenous insulative region is between the gate material and the channel material.

Transistors and memory arrays

Some embodiments include apparatuses and methods using a substrate, a pillar having a length perpendicular to the substrate, a first conductive plate, a second conductive plate, a memory cell located between the first and second conductive plates and electrically separated from the first and second conductive plates, and a conductive connection. The first conductive plate is located in a first level of the apparatus and being separated from the pillar by a first dielectric located in the first level. The second conductive plate is located in a second level of the apparatus and being separated from the pillar by a second dielectric located in the second level. The memory cell includes a first semiconductor material located in a third level of the apparatus between the first and second levels and contacting the pillar and the conductive connection, and a second semiconductor material located in a fourth level of the apparatus between the first and second levels and contacting the pillar.

Memory device having 2-transistor memory cell and access line plate

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell including a first transistor, a second transistor, and a dielectric structure formed in a trench. The first transistor includes a first channel region, and a charge storage structure separated from the first channel region. The second transistor includes a second channel region formed over the charge storage structure. The dielectric structure includes a first dielectric portion formed on a first sidewall of the trench, and a second dielectric portion formed on a second sidewall of the trench. The charge storage structure is between and adjacent the first and second dielectric portions.

Apparatus and method including memory device having 2-transistor vertical memory cell

Some embodiments include an integrated assembly having a first bottom electrode adjacent to a second bottom electrode. An intervening region is directly between the first and second bottom electrodes. Capacitor-insulative-material is adjacent to the first and second bottom electrodes. The capacitor-insulative-material is substantially not within the intervening region. Top-electrode-material is adjacent to the capacitor-insulative-material. Some embodiments include methods of forming integrated assemblies.

Integrated assemblies and methods of forming integrated assemblies

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell, first, second, and third data lines, and first and second access lines. Each of the first, second, and third data lines includes a length extending in a first direction. Each of the first and second access lines includes a length extending in a second direction. The memory cell includes a first transistor including a charge storage structure, and a first channel region electrically separated from the charge storage structure, and a second transistor including a second channel region electrically coupled to the charge storage structure. The first data line is electrically coupled to the first channel region. The second data line is electrically coupled to the first channel region. The third data line is electrically coupled to the second channel region, the second channel region being between the charge storage structure and the third data line. The first access line is located on a first level of the apparatus and separated from the first channel by a first dielectric. The second access line is located on a second level of the apparatus and separated from the second channel by a second dielectric. The charge storage structure is located on a level of the apparatus between the first and second levels.

Memory device having 2-transistor vertical memory cell

Some embodiments include a ferroelectric transistor. The transistor has gate dielectric material configured as a first container, with the first container having a first inner surface. Metal-containing material is configured as a second container nested within said first container. The second container has a second inner surface with an area less than the first inner surface. Ferroelectric material is configured as a third container nested within the second container. The third container has a third inner surface with an area less than the second inner surface. Gate material is within the third container. Some embodiments include memory arrays having ferroelectric transistors as memory cells. Some embodiments include methods of writing/reading relative to memory cells of memory arrays when the memory cells are metal-ferroelectric-metal-insulator-semiconductor (MFMIS) transistors.

Memory arrays, ferroelectric transistors, and methods of reading and writing relative to memory cells of memory arrays

A transistor comprises a first conductive contact, a heterogeneous channel comprising at least one oxide semiconductor material over the first conductive contact, a second conductive contact over the heterogeneous channel, and a gate electrode laterally neighboring the heterogeneous channel. A device, a method of forming a device, a memory device, and an electronic system are also described.

Devices including heterogeneous channels, and related memory devices, electronic systems, and methods

Some embodiments include an integrated assembly having a carrier-sink-structure, and having digit lines over the carrier-sink-structure. Transistor body regions are over the digit lines. Extensions extend from the carrier-sink-structure to the transistor body regions. The extensions are configured to drain excess carriers from the transistor body regions. Lower source/drain regions are between the transistor body regions and the digit lines, and are coupled with the digit lines. Upper source/drain regions are over the transistor body regions, and are coupled with storage elements. Gates are adjacent the transistor body regions. The transistor body regions, lower source/drain regions and upper source/drain regions are together comprised a plurality of transistors. The transistors and the storage elements are together comprised by a plurality of memory cells of a memory array. Some embodiments include methods of forming integrated assemblies.

Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies

Some embodiments include apparatuses and methods of operating such apparatuses. One of such apparatuses includes a data line, a conductive region, and a memory cell including a first transistor and a second transistor. The first transistor includes a first channel region coupled to the data line and the conductive region, a charge storage structure, and a first gate. The second transistor includes a second channel region coupled to the data line and the charge storage structure, and a second gate. The first gate is electrically separated from the second gate and opposite from the second gate in a direction from the first channel region to the second channel region.

Memory device having 2-transistor vertical memory cell and separate read and write gates

Semiconductor devices are disclosed. A semiconductor device may include a hybrid transistor configured in a vertical orientation. The hybrid transistor may include a gate electrode, a drain material, a source material, and a channel material operatively coupled between the drain material and the source material. The source material and the drain material include a first material and the channel material includes a second, different material.

Semiconductor devices and hybrid transistors

Growing community of inventors

Boise, ID, United States of America

Durai Vishak Nirmal Ramaswamy