Arista Networks, Inc.

Cisco Technology, Inc.

Duong Cu Lu

Robert Morris Wilcox

Richard Neville Hibbs

Ian Christopher Fry

Youngbae Park

Jiayi Wu

Arul Ramalingam

Tiffany Doria

Jim Weaver

Paul Miller

Hong Huynh

Toan N Nguyen

Phillip S Ting

Susheela Nanjunda Rao Narasimhan

Matthew Gawlowski

Alex Rose

Elliott B Van Hartingsveldt

Jeffrey Hirschman

Hong Tran Huynh

Susheela Nanjunda Rao Narasimham

A latch includes a retention portion. The retention portion is configured to prevent a first device, coupled to the latch, from being removed while the retention portion is in a first configuration. The retention portion is configured to allow the first device to be removed while the retention portion is in a second configuration. The latch also includes a spring portion configured to allow the retention portion to transition between the first configuration and the second configuration.

Decoupled latch

Systems for controlling louver positions are described herein. Such systems may include: a louver frame; a louver coupled to the louver frame via a rotation member and adapted to rotate at a louver side around an axis of rotation at the rotation member. In one embodiment, the louver includes a spring member engagement feature. The system also includes a spring member coupled to the louver frame and adapted to engage with the spring member engagement feature of the louver and apply a force to the louver when a forward airflow is applied to the louver in a forward airflow direction.

Variable louver control for fans

In general, embodiments relate to systems for latching electrical modules to one another. Specifically, embodiments provide for a latching assembly to mechanically aid an operative connection between electrical modules. Further, embodiments enable a user to physically latch electrical modules to one another and to retain the latching of the electrical modules.

Progressive latch for electrical module

An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.

Electromagnetic interference absorber ring

A busbar and connector assembly is provided. The busbar and connector assembly includes a printed circuit board having an attached connector arranged to couple to a first busbar and a second busbar coupled to the connector. The busbar and connector assembly includes the connector arranged to distribute a first portion of current from the first busbar to the printed circuit board and distribute a second portion of the current from the first busbar to the second busbar.

Hybrid power delivery assembly

A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Method and apparatus to mitigate assembly torsion

EMI absorber ring

To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Cooling arrangement for a rack mounted processing device

Growing community of inventors

Hayward, CA, United States of America

Duong Cu Lu