Wafer Solutions, Inc.

Duncan Dobson

Krishna Vepa

The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing () a wafer having initial thickness variations between two wafer surfaces. The wafer is subjected to grinding (), polishing () and cleaning () processes. The wafer is thereafter transferred () to a wafer processing chamber to undergo device formation processes (). The wafer processing steps may be undertaken in a series of process modules of sufficiently small size to permit their use in a circuit device fabrication facility. The in-fab processing of wafers reduces the number of process steps, cost and time typically associated with wafer processing prior to device formation thereon.

Growing community of inventors

Woodside, CA, United States of America

Duncan Dobson