Oracle International Corporation

Oracle America, Inc.

Duncan C Collier

Robert Paul Masleid

Aparna Ramachandran

King Yen

A multi-layer full dense mesh (MFDM) device. The MFDM may include a metal-top layer including a bump pad array that may include a power(PWR) bump pad within a PWRbump region, a VSS bump pad within a VSS bump region, and a power(PWR) bump pad within a PWRbump region. The metal-top layer may also include a PWRmajority metal-top region. The MFDM may also include a metal-top-layer beneath the metal-top layer and including a VSS majority metal-top-region, a PWRmetal-top-region, and a PWRmetal-top-region. The MFDM may also include a metal-top-layer beneath the metal-top-layer and including a PWRmajority metal-top-region, a VSS metal-top-region, and a PWRmetal-top-region. The MFDM may also include top-VIAs disposed between the metal-top layer and the metal-top-layer, and top-VIAs disposed between the metal-top-layer and the metal-top-layer.

Multi-layer full dense mesh

An integrated clock and power distribution network in a semiconductor device includes assigning a first tile to a location on a placement grid corresponding to a top metal layer. An orientation is assigned to the first tile relative to the top metal layer placement grid. The first tile is placed on a representation corresponding to the top metal layer in accordance with the assignments. A second tile is assigned to a location on a placement grid corresponding to a top-1 metal layer. The orientation is assigned to the second tile relative to the top-1 metal layer placement grid. The second tile is placed on a representation corresponding to the top-1 metal layer in accordance with the assignments. The first and second tile are arranged as a full-dense-mesh distribution structure. The first tile includes an integrated clock and power distribution structure. The second tile includes a low impedance underpass structure.

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Stockton, CA, United States of America

Duncan C Collier