Average Co-Inventor Count = 4.46
ph-index = 27
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (522 from 40,053 patents)
2. Other (1 from 832,347 patents)
523 patents:
1. 12424605 - Hybrid bonding with uniform pattern density
2. 12408466 - High-speed readout image sensor
3. 12396283 - 3DIC seal ring structure and methods of forming same
4. 12381195 - Semiconductor devices and methods of manufacture thereof
5. 12382744 - Stacked substrate structure with inter-tier interconnection
6. 12322694 - Metal-insulator-metal device with improved performance
7. 12315843 - Hybrid bonding technology for stacking integrated circuits
8. 12300670 - Hybrid bond pad structure
9. 12283564 - Semiconductor structure and manufacturing method thereof
10. 12278250 - Semiconductor device including image sensor and method of forming the same
11. 12255219 - Image sensor with overlap of backside trench isolation structure and vertical transfer gate
12. 12230554 - Shield structure for backside through substrate vias (TSVs)
13. 12224298 - Bond pad structure with high via density
14. 12218106 - Backside contact to improve thermal dissipation away from semiconductor devices
15. 12218166 - CSI with controllable isolation structure and methods of manufacturing and using the same