Input/output, Inc.

Other

Ion Geophysical Corporation

Duli Yu

Howard D Goldberg

Arjun Selvakumar

Lianzhong Yu

Martin Arnold Schmidt

James L Marsh

Matthew W Ip

Philip Simon

Bing-Fai Fung

Robert P Ried

W Marc Stalnaker

Ben William Jones

Peter Maxwell

Lawrence Philip Behn

Axel Michael Sigmar

Thomas M Buie

Kedu Han

Guido Lemke

Taechung Yi

Richard Laroo

Sjoerd Altman

Kees Faber

David Morgan

Klaus Domagalski

Demetrios Balderes

Ray Rinne

Larry Rushefsky

Fangfang Feng

Ben Jones

A capacitive accelerometer having one or more micromachined acceleration sensor assembly is disclosed. The acceleration sensor assembly comprises a spring-mass-support structure, a top cap and a bottom cap. The proof mass plate of the spring-mass-support structure has cutout spaces and is supported by a pair of branched torsional beams which are substantially located in the cutout spaces. The torsional axis of the proof mass plate is offset from the mass center in direction perpendicular to the proof mass plate. The acceleration sensor assembly further comprises multiple coplanar electrodes for differential capacitive sensing and electrostatic forcing. The capacitive accelerometer according to the present invention may comprise one, two or six micromachined acceleration sensor assemblies with electronic signal detection, conditioning and control circuits in different configurations and applications to detect and measure linear and angular accelerations. Methods to fabricate the micromachined acceleration sensor assembly are disclosed.

Micromachined accelerometer with monolithic electrodes and method of making the same

An accelerometer () for measuring seismic data. The accelerometer () includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer () also includes a top cap press frame recess () and a bottom cap press frame recess () for isolating bonding pressures to specified regions of the accelerometer (). The accelerometer () is vacuum-sealed and includes a balanced metal pattern () to prevent degradation of the performance of the accelerometer (). A dicing process is performed on the accelerometer () to isolate the electrical leads of the accelerometer (). The accelerometer () further includes overshock protection bumpers () and patterned metal electrodes to reduce stiction during the operation of the accelerometer ().

Sensor design and process

The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.

Digital optical switch apparatus and process for manufacturing same

A sensor apparatus () includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module () supported by a planar surface () within a cavity () of a housing () coupled to a first end cap () by a PC-board connection (). Housing () is further coupled to first end cap () by a first coupling member () and a second coupling member () and is also coupled to an opposite second end cap () by a third coupling member () and a fourth coupling member (). Interface sealing members () seal between housing () and first end cap (). Interface sealing members () seal between housing () and second end cap ().

Integrated and multi-axis sensor assembly and packaging

A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.

Low stress die attachment

Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.

Accelerometer with folded beams

A merged-mask micro-machining process is provided that includes the application of a plurality of layers of masking material that are patterned to provide a plurality of etching masks.

Merged-mask micro-machining process

A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.

Temporary bridge for micro machined structures

A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges. At least two electrostatic force application pads are disposed to rotate the mirror about a primary axis and about a secondary axis.

Dual axis micro machined mirror device

A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the z-direction. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.

Micro machined mirror

Growing community of inventors

Sugar Land, TX, United States of America

Duli Yu