Semiconductor Components Industries, LLC

Dukyong Lee

Seungwon Im

Oseob Jeon

Joonseo Son

Changyoung Park

Byoungok Lee

Yoonsoo Lee

Jerome Teysseyre

Roveendra Paul

Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

Integrated circuit direct cooling systems having substrates in contact with a cooling medium

In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus includes a cover defining a channel where the channel is outside of the module and the plurality of protrusions of the heatsink are disposed within the channel, and a sealing mechanism is disposed between the cover and the module is in contact with the module.

Heat transfer for power modules

Semiconductor package having a spacer with a junction cooling pipe

In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover including a channel where the plurality of protrusions of the heatsink are disposed within the channel, and can include a sealing mechanism disposed between the cover and the module.

Semiconductor package having junction cooling pipes embedded in substrates

Growing community of inventors

Cheon-an, South Korea

Dukyong Lee