Samsung Electronics Co., Ltd.

Dukseo Park

Sangil Jung

Changrok Moon

Seunghun Shin

Sunwoo Park

Jaejune Jang

Howoo Park

A decoupling capacitor includes a first insulating layer extending in a horizontal direction, a storage plate arranged on the first insulating layer, a top plate facing the storage plate, a second insulating layer interposed between the storage plate and the top plate and having a plurality of through holes, a capacitor block including a plurality of capacitor structures in the plurality of through holes, a wiring structure covering the top plate, a first conductive pad arranged on the wiring structure and configured to be electrically connected to the storage plate through a first conductive path of the wiring structure, and a second conductive pad spaced apart from the first conductive pad in the horizontal direction in the same plane as the first conductive pad and configured to be electrically connected to the top plate through a second conductive path of the wiring structure.

Discrete decoupling capacitor and integrated circuit chip package including same

An image sensor can include a photoelectric conversion part of an active region of a substrate and a trench in the substrate. A transfer transistor gate electrode can extend from outside the trench into the trench and terminate in the trench to provide an exposed portion of the trench in the photoelectric conversion part.

Image sensors including photoelectric conversion portions with increased area

Growing community of inventors

Gyeonggi-do, North Korea

Dukseo Park