Semes Co., Ltd.

Dukhyun Son

Byung Kyu Kim

Sang-Kee Lee

Hyungjoon Kim

Jaewon Shin

Sunghwan Hong

According to an aspect of the inventive concept, there is provided a plasma processing apparatus including a housing including a space accommodating a wafer therein, a gas supply member configured to supply gas into the housing, a plasma source generating a plasma from the gas supplied into the housing, and a magnetic field generating member disposed on the housing and configured to generate a magnetic field inside the housing, wherein the magnetic field generating member includes a first magnet unit disposed on the housing, and a second magnet unit disposed on the first magnet unit, wherein the second magnet unit is rotatable to change the magnetic pole of the upper portion and lower portion of the second magnet unit.

Plasma processing apparatus

Disclosed is a container. The container includes a housing having an interior space, and a support part that supports an expendable component in the interior space, and the support part includes an alignment pin that aligns the expendable component.

Container and substrate treating apparatus

The substrate treating apparatus includes a processing module and an index module on which a cassette having the substrate received therein is placed and that includes an index robot that transfers the substrate between the cassette and the processing module. The processing module includes a process chamber and a transfer chamber. The process chamber includes a support unit. The support unit includes a support on which the substrate is placed and a ring member that surrounds the substrate placed on the support and that is provided so as to be detachable from the support. The apparatus further includes a carrier storage unit that stores a carrier that is mounted on a hand of the main transfer robot or the index robot and on which the ring member is placed when the ring member is transferred by the main transfer robot or the index robot.

Apparatus and method for treating substrate

The inventive concept provides an apparatus and method for processing a substrate. The apparatus includes an index module and a processing module that is disposed adjacent to the index module and that processes the substrate. The index module includes one or more load ports, on each of which a carrier having the substrate received therein is placed, a side storage that stores the substrate subjected to a process in the processing module and removes fumes on the substrate, and a transfer frame including an index robot that transfers the substrate between the carrier placed on the load port, the side storage, and the processing module. The side storage includes a housing having an interior space, a partitioning unit that partitions the interior space into a plurality of receiving spaces independent of one another, and an exhaust unit that independently and separately evacuates the plurality of receiving spaces.

Apparatus and method for processing substrate

Disclosed is an apparatus for transferring a substrate. The apparatus includes a transfer robot, a linear rail unit including a movable plate on which the transfer robot is mounted and a running shaft on which the movable plate travels, and a particle diffusion prevention member that prevents diffusion of particles to the outside by maintaining a differential pressure between the movable plate and the running shaft.

Substrate transfer apparatus and substrate treating apparatus

A buffer unit for storing a substrate includes a housing having a buffer space inside, a substrate support unit that supports one or more substrates in the buffer space, a pressure adjustment unit that adjusts pressure in the buffer space, and a controller that controls the pressure adjustment unit. The pressure adjustment unit includes a gas supply line that supplies a gas for pressurizing the buffer space and a gas exhaust line that reduces the pressure in the buffer space. The controller controls the pressure adjustment unit to maintain the buffer space in a selected one of a filling mode in which the buffer space is filled with the gas and an exhaust mode in which the buffer space is evacuated.

Buffer unit, and apparatus and method for treating substrate with the unit

Embodiments of the inventive concept provide an apparatus and method for storing a substrate. A buffer unit for storing a substrate includes a housing having an entrance formed at one side and a buffer space inside, a substrate support unit that supports one or more substrates in the buffer space, a pressure adjustment unit that adjusts pressure in the buffer space, and a controller that controls the pressure adjustment unit. The pressure adjustment unit includes a gas supply line that supplies a gas for pressurizing the buffer space and a gas exhaust line that reduces the pressure in the buffer space. At least one of the gas supply line and the gas exhaust line includes a plurality of lines.

Buffer unit, and apparatus for treating substrate with the unit

Disclosed is a substrate treating apparatus which comprises a process chamber; an electrode configured to generate plasma from a gas supplied into the process chamber; an RF power supply configured to output an RF power; a transmission line configured to transmit the RF power to the electrode from the RF power supply; an impedance matching unit connected to the transmission line and configured to match plasma impedance; and a controller configured to output a control signal to the impedance matching unit, wherein the impedance matching unit comprises an adjustable capacitor having a plurality of capacitors and a plurality of switches corresponding to the plurality of capacitors, the plurality of switches being switched on/off according to the control signal so that capacitance of the adjustable capacitor is adjusted.

Growing community of inventors

Cheonan-si, South Korea

Dukhyun Son