Samsung Electronics Co., Ltd.

Duk-min Yi

Hwa-Sook Shin

Han-su Oh

Chul-ho Chung

A mesh-shaped gate electrode is located over a surface of a substrate. The mesh-shaped gate electrode includes a plurality of first elongate wirings extending parallel to one another, and a plurality of second elongate wirings extending parallel to one another. The first elongate wirings intersect the second elongate wirings to define an array of gate intersection regions over the surface of the substrate and to further define an array of source/drain regions of the substrate. To reduce gate capacitance, at least one oxide region may be located in the substrate below the mesh-shaped gate electrode. For example, an array of oxide regions may be respectively located below the array of gate intersection regions.

MOS transistor having a mesh-type gate electrode

A method for manufacturing a semiconductor memory device is disclosed. A spacer of a material having a high etching selection ratio with respect to an interdielectric layer is formed on a sidewall of a gate electrode. A refractory metal silicide layer is formed on an upper surface of the gate electrode and on an upper surface of a substrate on which source and drain regions are formed, thereby providing a contact hole self-aligned between the gate electrodes. Also, an ion implantation process is performed on the entire active region after the contact hole is filled with metal such as tungsten, and an impurity region is formed only on a lower portion of the gate electrode.

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Yongin, South Korea

Duk-min Yi