Hojin Platech Co., Ltd.

Duk Haeng Lee

Pan Soo Kim

Woon Taek Jung

Woon Suk Jung

The present invention relates to plating equipment and method for a solar cell wafer using electroplating and light-induced plating jointly. The plating equipment includes a jig allowing a wafer (), that is a body to be plated, to be vertically immersed into a plating solution at a center of a plating bath (), a first plating unit () comprising a plurality of anode members () symmetrically disposed on both sides of the plating bath () facing the wafer (), the first plating unit performing electroplating; and a second plating unit () disposed in a light source receiving unit () physically blocked from the first plating unit (), the second plating unit () being disposed at a rear side of the anode members () to perform light-induced plating by using an light emitting diode (LED) lamp () irradiating light onto the wafer ().

Plating equipment for solar cell wafer using electroplating and light-induced plating jointly and method of the same

Provided is a substrate carrier device for electroplating of a solar cell which simultaneously plates both surfaces of a wafer. The substrate carrier deviceincludes a wafer receiving areahaving an opening-shaped area and supporting an edge of the wafer to be received through a plurality of first protrusion supporting partsand a plurality of second protrusion partswhich are formed on an edge of the frame, clip mounting rodsandinstalled on left and right sides of the wafer receiving area to control a clip opening (forming a contact point with the wafer) and a clip closing (releasing a contact point with the wafer) while rotating at a fixed position, a plurality of first clipsinstalled on the clip mounting rod, opening and closing of the plurality of first clips being determined by a rotation of the clip mounting rod, and a plurality of second clipsinstalled around the wafer receiving areaon a second surface of the frame to pass through a holedefined in the second protrusion supporting part

Substrate carrier device for double-sided electroplating of solar cell

The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention, glycerin propoxylate ethoxylate is used as a carrier for relieving the deposit stress, and phenylurea is added as a deposit stress relieving additive. The copper electroplating solution of the present invention includes the phenylurea by from about 0.02 to about 0.08 g/l.

Growing community of inventors

Bucheon-si, South Korea

Duk Haeng Lee