International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Mediatek Corporation

Ericsson Ab

Globalfoundries Inc.

Duixian Liu

Brian Paul Gaucher

Xiaoxiong Gu

Alberto Valdes Garcia

Scott Kevin Reynolds

Jean-Olivier Plouchart

Bing Dang

Ullrich Richard Pfeiffer

Daniel Joseph Friedman

Bodhisatwa Sadhu

Alberto Valdes-Garcia

Christian Wilhelmus Baks

Brian Allan Floyd

Mihai A Sanduleanu

Thomas M Zwick

Arun Sridhar Natarajan

Ephraim Bemis Flint

Arun Paidimarri

Alberto V Garcia

Thomas Martin Zwick

Dong Gun Kam

Ullrich Richard Rudolf Pfeiffer

Cornelia Kang-I Tsang

Zhi Ning Chen

Janusz Grzyb

John Ulrich Knickerbocker

Thomas Richard Hildner

Christopher Vincent Jahnes

John Michael Cotte

Aydin Babakhani

Takeshi Asano

Chirag Suryakant Patel

John Harold Magerlein

Peter S Lee

Wooram Lee

Modest M Oprysko

Hideyuki Usui

Peter Jerome Sorce

Ola Ragnar Tageman

Joakim Hallin

Nils Deneke Hoivik

Ho Chung Chen

Johannes A G Akkermans

Michael A Gaynes

Kai D Feng

Kazuo Fujii

Jeffrey L Rogers

Howard Hao Chen

Young Hoon Kwark

Osamu Yamamoto

Masaki Oie

Bo Wen

Shohhei Fujio

Ho-Chung Chen

Kazuo Masuda

Thomas Wayne Studwell

Frank J Canora

Robert M Morton

Loïc Marnat

Ranjani Sirdeshmukh

Md Rashidul Islam

Changyu Wu

Atif Shamim

Cornelia K-i Tsang

Thomas Hildner

A package structure is provided that includes a planar core structure comprising a first side and a second side opposite the first side. The package structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure comprises a plurality of first laminated layers, each first laminated layer comprising a first patterned conductive layer formed on a first insulating layer, an antenna formed on one or more first patterned conductive layers of the first laminated layers, the antenna including at least one L-shaped structure. The package structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feed line structure formed in, and routed through, the interface structure and the planar core structure, wherein the antenna feed line structure is not connected to the planar antenna.

Dual-polarized magneto-electric antenna array

A system for interfacing an in-body medical device with an external network includes a subdermal wideband on-body network (WON) hub, which in turn includes a hub rechargeable battery, a hub processor coupled to the hub rechargeable battery, a device interface configured to communicate with the in-body medical device, and coupled to the hub processor, and a hub-satellite near field communications wireless interface coupled to the hub processor. The system also includes a wearable WON server that in turn includes a server processor, a server-satellite interface coupled to the server processor, and an external network interface coupled to the server processor. The server processor implements a software controller; and a skin-mountable WON tethered satellite that includes a wired satellite-server interface, coupled to the wearable WON server, and a tethered satellite near-field communications (NFC) wireless interface, configured to communicate with the hub-satellite NFC wireless interface, and coupled to the wired satellite-server interface.

Medical device system

Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.

Wireless communications package with integrated antenna array

A radio frequency identification (RFID) system. An RFID tag may include multiple antennas connected with associated circuitry. An RFID tag's multiple antennas and associated circuitry are connected in parallel, and output power of the multiple associated circuitry can be combined. Each of the multiple antennas can be tuned for a different operating property or region. An RFID reader can include multiple antennas connected with associated circuitry. RFID reader's multiple antenna interfaces connect with a baseband processor, which can integrate resources of the reader's multiple antennas and associated circuitry. RFID tag and/or reader can be configured to support wireless channel diversity in enhancing at least one of power delivery and communication link budget.

Leveraging channel diversity in wireless power and communication

An antenna that can be embedded in a computer system or device is described. In an example, the antenna includes a feed operable to transmit and receive power. The antenna includes a first arm being extended from the feed towards a first direction to form a first partial loop. The antenna further includes a second arm being extended from the feed towards a second direction to form a second partial loop. The second direction is different from the first direction.

Compact dipole antenna design

An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.

Integrated antenna array packaging structures and methods

A device includes a transmitter. A main antenna is coupled to the transmitter. A matching network coupled to the transmitter and configured to match an impedance of the main antenna, wherein one or more components of the matching network provide a desired radiation.

Efficiency antenna impedance matching

A radio frequency identification (RFID) system may include a plurality of RFID readers and RFID tags. A RFID reader may include an antenna configured to operate at a first frequency and transmit a first beam of a first beam width to the plurality of RFID tags. The RFID antenna may further include an antenna array including a plurality of antennas configured to operate at a second frequency. The antenna array may be configured to transmit a second beam of a second beam width to the plurality of RFID tags. The RFID reader may receive backscatter signals and tag data from the plurality of RFID tags. The RFID reader may locate the plurality of RFID tags based on the backscatter signals and a direction of the second beam. The RFID reader may generate a 3D map of the tag data based on the locations of the plurality of RFID tags.

Simultaneous wireless power transmission, communication, and localization

Systems, devices, and techniques facilitating wirelessly charging and/or communicating with one or more electronic devices (e.g., electronic wearable devices) are provided. A device can comprise a memory and a storage component that can be operatively coupled to the memory. The storage component can comprise one or more recesses that can receive a second device that can be charged by the storage component. The storage component can comprise a charging circuit and an inductive circuit that can be coupled to the charging circuit. The storage component can harvest energy from one or more energy sources to charge the charging circuit. Based on the energy harvested, the inductive circuit can inductively couple to the second device having a second inductive circuit and positioned in at least one of the recesses and the inductive circuit can charge a power source of the second device.

Facilitation of charge of and communication with an electronic device

Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.

Scalable phased array package

Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

Antenna-in-package structures with broadside and end-fire radiations

Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

Hybrid-on-chip and package antenna

Growing community of inventors

Scarsdale, NY, United States of America

Duixian Liu