Samsung Electro-mechanics Co., Ltd.

Duck Young Maeng

Tae Hoon Kim

Jung Soo Kim

Jin Won Lee

Sang Hoon Kim

Yong Duk Lee

Mi Sun Hwang

Dae Jung Byun

Yoong Oh

Jee Soo Mok

Suk-Hyeon Cho

Byung Kook Sun

Chang-Kyu Song

Jong Suk Bae

A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.

Printed circuit board

A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.

Printed circuit board and substrate including electronic component embedded therein

Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

Method of manufacturing package substrate with fine circuit pattern using anodic oxidation

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Suwon-si, South Korea

Duck Young Maeng