International Business Machines Corporation

Duane T Napp

Peter Bakos

Lawrence M Baldauf

Kevin J Roche

Alignment of leaded surface mount components to solder pads is enhanced by providing at least two soldered areas per lead, separated by a space of non-wettable material so that during component placement on the soldered areas there is a tendency for the components to self center as the leads fall between the raised soldered areas where they are retained during a reflow operation.

Component self alignment

A process for making printed circuit cards is disclosed wherein a copper clad, insulating substrate having a layer of copper from which circuitry lines and patterns will be fabricated, is coated with a thin layer of nickel prior to forming any circuit patterns.

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Austin, TX, United States of America

Duane T Napp