Artesyn Technologies, Inc.

Duane E Dixon

Marty Perry

Ian Poynton

A housing for a transformer is disclosed. According to one embodiment, the housing includes a top portion, and first, second, third and fourth side portions connected to the top portion. The side portions define an opening. The third side portion includes a first alignment tab and the fourth side portion includes a second alignment tab. The housing also includes first, second, third and fourth termination legs. The first and second termination legs are proximate the third side portion, and the third and fourth termination legs proximate the fourth side portion. A transformer may be disposed in the opening defined by the side portions of the housing.

Housing for a transformer

A surface mount power supply device and a method for mounting a lead frame to a circuit board, which has a first and second side, and assembling such a device. The lead frame has leads with a lead solder area for contact with solder material on the circuit board. According to the method, the lead frame and a first set of electrical components are reflow soldered on the first side of the circuit board. Then the circuit board is inverted and a second set of electrical components are reflow soldered on the second surface of the circuit board. The lead solder area and in particular the ratio of the weight of the frame to the lead solder area is chosen so that the lead frame remains connected to the first side of circuit board during the second reflow soldering.

Surface mount power supply device and associated method

A method for assembling a multi-deck power supply device including control and power components. The method comprises providing a first circuit board having a first and a second side. Two prefabricated pin holders are positioned on the first side of the first circuit board. Each pin holder includes two threaded inserts, a set of first pins and a set of second pins. The first pins are floating for self-alignment during soldering. After the first pins are soldered on the first side of the first circuit board, a second circuit board is aligned above the first circuit board, and the first and second pins are soldered to the second circuit board. The first pins may include pre-assembled oscillation dampers, such as magnetic material beads.

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Tucson, AZ, United States of America

Duane E Dixon