Growing community of inventors

Hillsboro, OR, United States of America

Drew G Damm

Average Co-Inventor Count = 4.48

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 52

Drew G DammRalph V Miele (3 patents)Drew G DammAndrew Larson (3 patents)Drew G DammMark E Sprenger (2 patents)Drew G DammKenan Huseyin Arik (2 patents)Drew G DammDan H Gerbus (2 patents)Drew G DammShyamjith Mohan (2 patents)Drew G DammJames Utz (1 patent)Drew G DammEduardo Escamilla (1 patent)Drew G DammGustavo Fricke (1 patent)Drew G DammBaomin Liu (1 patent)Drew G DammTongyan Zhai (1 patent)Drew G DammJames M Yoder (1 patent)Drew G DammMeenakshi Gupta (1 patent)Drew G DammVenkat R Gaurav (1 patent)Drew G DammBrian R Peil (1 patent)Drew G DammRicky O Branner (1 patent)Drew G DammKenan Arik (0 patent)Drew G DammDrew G Damm (5 patents)Ralph V MieleRalph V Miele (32 patents)Andrew LarsonAndrew Larson (12 patents)Mark E SprengerMark E Sprenger (46 patents)Kenan Huseyin ArikKenan Huseyin Arik (11 patents)Dan H GerbusDan H Gerbus (7 patents)Shyamjith MohanShyamjith Mohan (3 patents)James UtzJames Utz (38 patents)Eduardo EscamillaEduardo Escamilla (37 patents)Gustavo FrickeGustavo Fricke (18 patents)Baomin LiuBaomin Liu (8 patents)Tongyan ZhaiTongyan Zhai (7 patents)James M YoderJames M Yoder (6 patents)Meenakshi GuptaMeenakshi Gupta (5 patents)Venkat R GauravVenkat R Gaurav (4 patents)Brian R PeilBrian R Peil (4 patents)Ricky O BrannerRicky O Branner (1 patent)Kenan ArikKenan Arik (0 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Intel Corporation (5 from 54,750 patents)


5 patents:

1. 10990129 - Convertible dual screen laptop

2. 10435932 - Fastenerless hinge which enables thin form factor low cost design

3. 10412560 - Mobile device cooling and performance management

4. D808950 - Dual screen notebook computer

5. 9703327 - Fastenerless hinge which enables thin form factor low cost design

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as of
12/28/2025
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