Raytheon Company

Drew Fairbanks

Christian M Boemler

Sean P Kilcoyne

Justin Gordon Adams Wehner

Eric R Miller

Eric Miller

Methods and apparatus for an assembly having directly bonded first and second wafers where the assembly includes a backside surface and a front side surface. The first wafer includes IO signal connections vertically routed to the direct bonding interface by a first one of the bonding posts on the first wafer bonded to a first one of the bonding posts on the second wafer. The second wafer includes vertical routing of the IO signal connections from first one though the bonding posts on the second wafer to IO pads on a backside surface of the assembly.

Growing community of inventors

Santa Barbara, CA, United States of America

Drew Fairbanks