Samsung Electronics Co., Ltd.

Doyoung Choi

Daewon Ha

Mingyu Kim

Seungjoon Lee

Munhyeon Kim

Nakjin Son

Bong Seob Yang

Jae Hyun Park

Seungjae Lee

Dongsuk Shin

Wandon Kim

Dongsoo Lee

Sungil Park

Sunhom Steve Paak

Minchan Gwak

Kyungho Kim

Myungil Kang

Dongho Cha

Tae Eung Yoon

Suyoung Bae

Seonguk Park

Kyoung Hwan Yeo

Youngmoon Choi

Donghoon Hwang

Kyung Hee Cho

Ruiyi Chen

Jaeseoung Park

A three-dimensional semiconductor device includes a first active region on a substrate, the first active region including a lower channel pattern and a lower source/drain pattern connected to the lower channel pattern, a second active region stacked on the first active region, the second active region including an upper channel pattern and an upper source/drain pattern connected to the upper channel pattern, a gate electrode on the lower channel pattern and the upper channel pattern, a lower contact electrically connected to the lower source/drain pattern, the lower contact having a bar shape extending on the lower source/drain pattern in a first direction, a first active contact coupled to the lower contact, and a second active contact coupled to the upper source/drain pattern. A first width of the lower source/drain pattern in a second direction is larger than a second width of the lower contact in the second direction.

Three-dimensional semiconductor device and method of fabricating the same

A semiconductor device includes a substrate including first and second regions, first and second active patterns provided on the first and second regions, respectively, a pair of first source/drain patterns on the first active pattern and a first channel pattern therebetween, a pair of second source/drain patterns on the second active pattern and a second channel pattern therebetween, first and second gate electrodes respectively provided on the first and second channel patterns, and first and second gate insulating layers respectively interposed between the first and second channel patterns and the first and second gate electrodes. Each of the first and second gate insulating layers includes an interface layer and a first high-k dielectric layer thereon, and the first gate insulating layer further includes a second high-k dielectric layer on the first high-k dielectric layer.

Semiconductor device and method of manufacturing the same

A semiconductor device includes: an active pattern extending in a first direction on a substrate; a first lower source/drain pattern and a second lower source/drain pattern provided on the active pattern and spaced apart from each other in the first direction; a first upper source/drain pattern provided on the first lower source/drain pattern; a second upper source/drain pattern provided on the second lower source/drain pattern; and a gate electrode crossing the active pattern and extending in a second direction intersecting the first direction. The gate electrode includes an overlapping portion overlapping the active pattern in a third direction perpendicular to the first direction and the second direction. A length of the overlapping portion in the second direction is less than a length of the first lower source/drain pattern in the second direction.

Semiconductor device

A semiconductor device includes an active pattern on a substrate, a plurality of source/drain patterns in a first direction on the active pattern, a first channel structure between a pair of source/drain patterns, a second channel structure between another pair of source/drain patterns, a first gate electrode extending in a second direction perpendicular to the first direction, and a second gate electrode intersecting the second channel structure and extending in the second direction. The first gate electrode includes a first portion between a bottom surface of the first channel structure and a top surface of the active pattern, and the second gate electrode includes a first portion between a bottom surface of the second channel structure and the top surface of the active pattern. A thickness of the first portion of the second gate electrode is greater than a thickness of the first portion of the first gate electrode.

A semiconductor device is disclosed. The semiconductor device may include an active pattern on a substrate, source/drain patterns on the active pattern, a fence spacer on side surfaces of each of the source/drain patterns, a channel pattern interposed between the source/drain patterns, a gate electrode crossing the channel pattern and extending in a first direction, and a gate spacer on a side surface of the gate electrode. A first thickness of an upper portion of the fence spacer in the first direction may be greater than a second thickness of the gate spacer in a second direction crossing the first direction.

Semiconductor device and method of fabricating the same

A semiconductor device include a substrate including a peripheral region, a first active pattern provided on the peripheral region of the substrate, the first active pattern having an upper portion including first semiconductor patterns and second semiconductor patterns which are alternately stacked, a first gate electrode intersecting the first active pattern, a pair of first source/drain patterns provided at both sides of the first gate electrode, respectively, and a first gate insulating layer disposed between the first gate electrode and the first active pattern. The first gate insulating layer includes a first insulating layer formed on the first active pattern, a second insulating layer formed on the first insulating layer, and a high-k dielectric layer formed on the second insulating layer. The first gate insulating layer contains a first dipole element including lanthanum (La), aluminum (Al), or a combination thereof.

Semiconductor device and method for manufacturing the same

Provided is a semiconductor device with a field effect transistor. The semiconductor device includes a substrate, an active pattern on the substrate, a gate electrode crossing the active pattern and a capping structure on the gate electrode. The capping structure includes first and second capping patterns that are sequentially stacked on the gate electrode. The second capping pattern completely covers a top surface of the first capping pattern, and a dielectric constant of the second capping pattern is greater than that of the first capping pattern.

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Hwaseong-si, South Korea

Doyoung Choi