Applied Materials South East Asia Pte. Ltd.

Negevtech Ltd.

Rd Synergy Ltd.

Acousticeye Ltd

Arise Global Pte. Ltd

Beam-med Ltd.

Dov Furman

Noam Dotan

Shai Silberstein

Gad Neumann

Mark Wagner

Ram Segal

Efraim Miklatzky

Daniel Mandelik

Silviu Zilberman

Harel Primack

Ehud Tirosh

Martin David Abraham

Ran Zaslavsky

Noam Amir

Oded Barzelay

Liat Tsoref

Yuval Dorphan

Effy Miklatzky

Roy Kaner

Ori Gonen

Eran Tal

A holographic interferometer, comprising: at least one imaging device capturing an interference pattern created by at least two light beams; and at least one aperture located in an optical path of at least one light beam of the at least two light beams; wherein the at least one aperture is located away from an axis of the at least one light beam, thus transmitting a subset of the at least one light beam collected at an angle range.

Methods and systems of holographic interferometry

A holographic interferometer, comprising: an imaging device capturing an interference pattern created by at least two polarized light beams; a structured phase retardation element located in an optical path of at least one polarized light beam of the at least two polarized light beams; and a polarizer located between the imaging device and the structured phase retardation element, the polarizer projects each polarization of each of the at least two polarized light beams on a single axis to create the interference pattern on the imaging device.

Tube inspections are performed by combining the use of APR technology with GW technology. The reflections measured by both technologies are compared to each other and used to more specifically identify the type and location of a flaw or anomaly that appears in the interior of the tube. Further, embodiments of novel probes to be used in GW technique for inspecting tubes with mechanical waves having bandwidth that is equal to 150 KHz or more are disclosed.

Non-traversing tube inspection system

Exemplary embodiments of a handheld probe (HHP) of an Acoustic pulse reflectometry (APR) system are disclosed. Embodiments of the HHP can comprise a loudspeaker and microphone that are vibration isolated from each other and from the tube under test. In some embodiments the microphone can be isolated from the housing of the HHP. In other embodiments the housing of the HHP can be isolated from the loudspeaker. In another embodiment the housing of the probe can be isolated from the tube under test. Yet, some embodiments combine all of this isolation options. In such embodiment the loudspeaker is isolated from the housing, the housing is isolated from the tube under test, and the microphone is isolated from the housing, and so on. Isolation can be achieved by using materials that absorb vibration, material such as but not limited to rubber, foam, silicone, etc.

Handheld probe for tube inspection using APR

Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described. Other novel aspects of the system include a system for compensating for variations in the pulse energy of a Q-switched laser output, methods for autofocussing of the wafer imaging system, and novel methods for removal of repetitive features of the image by means of Fourier plane filtering, to enable easier detection of wafer defects.

System for detection of wafer defects

An optical inspection system or tool can be configured to adjust the distribution of light by using one or more diffusers. The diffusers can be variable in some embodiments. For example, the angular or spatial distribution of the illumination can be adjusted to minimize intensity of illumination outside of an imaged area to thereby reduce illumination loss. The angular or spatial distribution may additionally or alternatively be adjusted so that the illumination across an illuminated area is substantially uniform. The use of one or more diffusers may aid in the inspection of semiconductor objects including, but not limited to, semiconductor wafers and the like.

Optical inspection tools featuring light shaping diffusers

An inspection system can support operation in multiple states. For instance, when inspecting an article, such as a semiconductor wafer, the tool can switch between imaging multiple locations using respective detectors to another operating state wherein multiple detectors operating in multiple imaging modes inspect a single location. An inspection system may combine the use of multiple detectors for multiple locations and the use of multiple viewing angles or modes for the same locations and thereby achieve high throughput. The different imaging modes can comprise, for example, different collection angles, polarizations, different spectral bands, different attenuations, different focal positions relative to the wafer, and other different types of imaging.

Inspection tools supporting multiple operating states for multiple detector arrangements

A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.

Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images

An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, along an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.

Multi mode inspection method and apparatus

In an optical inspection tool, an image of an object under inspection, such as a semiconductor wafer, may be obtained using imaging optics defining a focal plane. Light comprising the image can be detected using multiple detectors which each register a portion of the image. The image of the object at the focal plane can be split into two, three, or more parts by mirrors or other suitable reflecting elements positioned tangent to the focal plane and/or with at least some portion at the focal plane with additional portions past the focal plane so that the focal plane lies between the imaging optics and the splitting apparatus. In some embodiments, reflective planes may be arranged to direct different portions to different detectors. Some reflective planes may be separated by a gap so that some portions of the light are directed while some portions pass through the gap. Other splitting elements may comprise a group of transmissive and reflective areas interspersed in an element positioned at or in the focal plane, with some portions of the light are reflected to detectors while other portions pass through the element(s) to other detectors. Splitting apparatuses and elements may be cascaded.

Image splitting in optical inspection systems

In an optical inspection tool, an image of an object under inspection, such as a semiconductor wafer, may be obtained using imaging optics defining a focal plane. Light comprising the image can be split into portions that are detected using multiple detectors which each register a portion of the image. The image of the object at the focal plane can be split into two, three, or more parts by polarization-based beam splitters and/or lenses positioned tangent to the focal plane. The splitting apparatus may comprise a pair of arrays of half-cylinder lenses comprising a convex side and a flat side. The arrays can be positioned with the cylinder axes perpendicular to one another and the flat sides facing each other. Thus, the pair of arrays can divide incoming light into a plurality of rectangular portions without introducing non-uniformities which would occur if several spherical lenses are configured for use in a rectangular array.

A method and an apparatus for estimating bone age by at least one acoustic signal in an ossification-actuated skeletal structure. The apparatus includes an acoustic transmitter and an acoustic receiver positioned facing each other so that the structure is positioned between them. The structure has at least two bones. The transmitter is adapted for transmitting a signal to cross the structure transversely. An electronic moveable gantry is provided for adjusting the position of the acoustic transmitter and the acoustic receiver in relation to the structure. A computer system is enabled to perform one or more functions to position the moveable gantry; transmit the signal by the transmitter; control the signal transmitted by the transmitter; receive the transmitted signal by the receiver; and estimate bone age responsive to the received signal by at least one bone age calculation formula.

Bone age assessment using ultrasound

An inspection system may be configured to inspect objects, such as semiconductor wafers, using narrow-pulse broadband illumination. The illumination may be obtained in some embodiments using a laser configured to emit light into a material having a spectral broadening effect. The inspection system can include various filters which may be selectively placed in the illumination and/or imaging path in order to tune the spectrum of light impinging on the wafer and the light that is detected. The filters may include selectable filters, fixed filters, and filters whose characteristics can be adjusted in-place. In some embodiments, filters may be used to match the illumination/detection spectra of different tools. Additionally, the broadband illumination may be tuned between inspections and/or during inspections for best results. The system may support Fourier filtering whereby light, related to repetitive features of the object and in one or more wavelength sub-bands of the illumination, may be filtered.

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Rehovot, Israel

Dov Furman