Raytheon Company

Douglas W Wolfe

David Alan Rockwell

Fabio Di Teodoro

Marco A Avila

Charles P Minning

John H Schroeder

A system includes multiple laser diode modules that are spatially separated and configured to generate multiple optical beams that propagate at angles relative to each other. The system also includes an optical element having at least one entrance surface and at least one exit surface. The optical element is configured to receive the optical beams at the at least one entrance surface and output each optical beam through the at least one exit surface such that the output optical beams are closely spaced, substantially the same size, and substantially parallel to each other at a common distance downstream from the optical element, and the optical beams all share a common downstream image plane.

High-brightness spatial beam combining of laser modules yielding a common image plane

An electronic substrate is formed of a porous planar heat exchanger and an orifice plate overlying and thermally contacting the heat exchanger. The orifice plate has a plurality of apertures therethrough. An electronic device is mounted to the orifice plate. A coolant such as air or other gas is forced through the heat exchanger and the apertures of the orifice plate to remove heat that is generated by the electronic device. Preferably, at least two of the assemblies formed of the substrate and the mounted electronic device are mounted in a facing relationship to form a multichip module. A housing is provided to support the assemblies and to channel the flow of coolant through the substrates. Electrical interconnection between the components is provided by a peripheral ring with electrically conducting paths therethrough, which ring extends between the facing substrates.

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La Habra Heights, CA, United States of America

Douglas W Wolfe