Tektronix, Inc.

Tektronic, Inc.

Douglas W Trobough

Bozidar Janko

Richard Guy Chambers

Peter M Compton

Paul A Cole

Marianne McPherson

Wolfgang H Herr

Raymond L Helton

Mark B Trobough

A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.

Adapter and test fixture for an integrated circuit device package

A flexible circuit board is formed from a sheet of polyimide having a contact pad on its first side and a continuous layer of copper on its second side by removing copper from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.

Method of forming a conductive contact bump on a flexible substrate and

A deformable connector provides a concentrated wiping action pressure during the connection process, yet forms a flat mating surface when it is fully mated, and that is also suitable for providing a double density connection between a printed circuit board and a flexible circuit cable, as well as other applications. The connector includes an elastomeric member whose lower surface has a first convex region at one end, a second convex region at the other end, and a concave region in a middle joining the first and second convex regions. The upper surface contains a convex region in its middle that is approximately parallel to the concave region of the lower surface, producing an approximately constant thickness over most of the length of the elastomeric member, thus forming a flat mating surface in its fully mated condition. Conductive runs to be connected to a mating surface are disposed on the lower surface of a flexible circuit or cable affixed to the lower surface of the elastomeric member. A frame member and fastening means apply downward pressure to the convex region of the upper surface of the elastomeric member and thereby cause the first and second regions of the lower surface of the elastomeric member to move outwardly, creating a wiping contact between the plurality of conductive runs and the mating surface. In a preferred embodiment, the ends of the upper surface of the elastomeric member converge toward the outer ends of the lower surface to produce tapered ends for strain relief.

High density planar interconnect

An alkaline, cyanide, aqueous electroplating composition of copper, tin, and zinc includes a small amount of nickel to enhance the inclusion of tin in the copper-tin-zinc plate deposited from the soltion. The plate resists tarnishing by a corrosion test solution, and retains its bright silvery-colored appearance because the plate preferably includes at least about 10.9 atomic wt % tin. The plating method for enhanced tin alloys through nickel additions to the bath is also described.

Plating bath composition for copper-tin-zinc alloy

An alkaline, cyanide, aqueous electroplating composition of copper, tin, and zinc includes a small amount of nickel to enhance the inclusion of tin in the copper-tin-zinc plate deposited from the solution. The plate resists tarnishing by a corrosion test solution, and retains its bright silvery-colored appearance because the plate preferably includes at least about 10.9 atomic wt % tin. The plating method for enhanced tin alloys through nickel additions to the bath is also described.

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Beaverton, OR, United States of America

Douglas W Trobough