Zinite Corporation

University of Alberta

Purdue Research Foundation

Douglas W Barlage

Lhing Gem Shoute

Kenneth C Cadien

Alex Munnlick Ma

Eric Wilson Milburn

Dimitrios Peroulis

Lhing Gem Kim Shoute

Alden N Fisher

Thomas R Jones

Novel semiconductor devices are taught. The novel devices include a thin film transistor (TFT) with an n-type semiconductor layer to form a channel between a source and a drain. The TFT further includes a source-channel interfacial member adjacent to at least the source contact of the device to provide depletion layer control of the operation of the TFT.

Thin film semiconductor switching device

A waveguide assembly integrated with a semiconductor wafer is provided. The waveguide assembly includes a waveguide channel defined by internal walls of the wafer lined with a metallic layer, and having at least one port for transmission of the RF signal into or out of the waveguide channel. The waveguide assembly also includes a semiconductor obstacle member disposed in the waveguide channel. The waveguide assembly may be fabricated using etching and deposition processes for semiconductor devices. In use, selectively varying either one or both of frequency or power level of electromagnetic radiation applied to the obstacle member varies electrical conductance of the obstacle member, and thereby varies the electrical impedance of the obstacle member to transmission of the RF signal through the waveguide channel. The waveguide assembly may be used for switching, attenuating, routing, filtering, and transforming the RF signal.

Semiconductor system with waveguide assembly with RF signal impedance controllable by applied electromagnetic radiation

An active via is taught which comprises at least one via and at least one transistor which acts as a switch element. The resulting active via can be used with 1D, 2.5D or 3D chips to: control circuit elements; reduce EMI between vias; increase the density of vias; improve power and thermal efficiencies of chips; simplify power, data and other routing networks on chips; enable a higher level stacking of dies or layers in a chip while maintaining modularity; etc. A control strategy system can be provided to remove the supply of power to one or more regions of the chip when the regions are not in use and to supply power to those regions when the regions are in use, or to control input and output to regions of the chip. The active vias can be fabricated with Back or Front End Of Line processes.

Active via

An analog open-loop self-oscillating boost converter is provided including: an output terminal for supplying an output voltage bus; an input terminal for receiving variable input power; a varactor positioned in series with the input terminal; and an oscillating network having an inductor, a resistor and a capacitor in a parallel orientation, the oscillating network connected to a semiconductor device and the varactor.

Frequency dependent analog boost converter for low voltage applications

Growing community of inventors

Edmonton, Canada

Douglas W Barlage