Microsoft Technology Licensing, LLC

Cray Incorporated

Electric Power Research Institute Incorporated

Omax Corporation

Flowdril Corporation

Douglas Patrick Kelley

Wade J Doll

Alexander I Yatskov

Alexis Grace Schubert

Chidambaram Raghavan

John H Olsen

Olivier L Tremoulet, Jr

Dennis Trieu

Andre Kashierski

Karin Strauss

Bichlien Hoang Nguyen

Kevin Hay

Kathryn Midori Oseen-Senda

Kathryn M Oseen-senda

Husam Atallah Alissa

Nicholas Andrew Keehn

Craig Steven Ranta

Luis Henrique Ceze

Bharath Ramakrishnan

Ioannis Manousakis

Douglas M Carmean

Hsing-Yeh Parker

Yuan-Jyue Chen

Matthew David Turner

Robert Carlson

Rick Marks

John Mulligan

David Bazeley Tuckerman

Eric Clarence Peterson

Christian L Belady

Mark Edward Shaw

Dawson Yee

Stephen V R Hellriegel

Martin Brokner Christiansen

James M Reichman

Thomas A O'Hanlon

Martha Geoghegan Peterson

Scott D Veenhuizen

Cliff C Lee

James Anthony Fikse

Thomas F Zimmerman

Thomas A Auciello

Martin B Christiansen

A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.

Systems and methods for two-phase cooling of electronic components

In some embodiments, a thermal management system includes an immersion tank defining an immersion chamber, a two-phase working fluid positioned in the immersion chamber, and a pressure trim device in fluid communication with the immersion chamber. The pressure trim device includes at least one of a cold thermal sink and a hot thermal sink. The cold thermal sink is maintained at a suppressed temperature less than a boiling temperature of the two-phase working fluid. The hot thermal sink is maintained at an elevated temperature greater than a boiling temperature of the two-phase working fluid.

Systems and methods for adjusting pressure in immersion-cooled datacenters

A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

3-D structured two-phase microfluidic cooling with nano structured boiling enhancement coating

A system includes a synthesizer unit having a fluid input to receive fluids and a communication input to receive commands to synthesize data-encoded DNA sequences and cleave the DNA. A first flexible chemistry reaction chamber module may be fluidically coupled to the synthesizer unit to receive the data-encoded DNA sequences and amplify the sequences. A deposition unit may be fluidically coupled to the first flexible chemistry reaction chamber module to receive the amplified DNA sequences and encapsulate the amplified DNA sequences into one or more wells in a storage plate for storage and retrieval to and from a plate storage unit. Retrieved DNA may be processed and read by further units.

Rotatable device containing wafers for DNA processing

A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

3-D structured two-phase cooling boilers with nano structured boiling enhancement coating

High temperature superconductor (HTS)-based interconnect systems comprising a cable including HTS-based interconnects are described. Each of the HTS-based interconnects includes a first portion extending from a first end towards an intermediate portion and a second portion extending from the intermediate portion to a second end. Each of the HTS-based interconnects includes a substrate layer formed in the first portion, in the intermediate portion, and in the second portion, a high temperature superconductor layer formed in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion, and a metallic layer formed in the first portion and in at least a sub-portion of the intermediate portion. The HTS-based interconnect system includes a thermal load management system configured to maintain the intermediate portion of each of the HTS-based interconnects at a predetermined temperature in a range between a temperature of 60 kelvin and 92 kelvin.

High temperature superconductor-based interconnect systems with a lowered thermal load for interconnecting cryogenic electronics with non-cryogenic electronics

Backplane employing floating backplane network interconnects for electrical coupling with blade computer systems and related methods. To provide a displacement tolerant interconnection system between the backplane interconnects and respective blade backplane interconnects of blade computer systems to establish electrical connections therebetween, the backplane interconnects are provided as floating backplane interconnections. The floating backplane interconnects are configured to move and be displaced relative to the backplane while still retaining an electrical connection to the backplane. The backplane interconnects each include one or more flex circuits connected to electrical interconnects on the backplane on a first end, and electrical interconnects on a backplane connector on a second end. The flex circuit(s) include an electrical cable that includes a polymer or other material surrounding electrical wires to allow the flex circuit and its internal electrical wires to bend and flex, and thus move relative to backplane.

Backplane interconnect system employing floating backplane interconnects for coupling a backplane with blade computer systems

The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Computer cooling

The description relates to passive two-phase immersion cooling of computers, such as servers. One example can include multiple liquid immersion tanks configured to contain servers immersed in a liquid-phase of a coolant having a boiling point below a maximum operating temperature of the servers such that operation of the servers generates heat that is transferred to the liquid phase of the coolant and causes a portion of the coolant to boil to a gas phase of the coolant. The example can include a single phase separator tank and a single heat exchanger coupled to the multiple liquid immersion tanks as a sealed cooling system and configured to receive the gas phase of the coolant and configured to transition the gas phase of the coolant back to the liquid phase of the coolant and to automatically deliver liquid phase of the coolant to an individual liquid immersion tank responsive to further boiling producing additional gas phase of the coolant that evacuates the individual liquid immersion tank.

Passive two-phase computer cooling

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

Systems with indium application to heat transfer surfaces

DNA manufacturing, storage, and access system

Reagents and solvents used for polymer synthesis are reused or recycled rather than discarded. The outflow from each step of polymer synthesis may be collected separately in one of multiple dedicated containers. Reuse returns the outflow from a step of polymer synthesis back to an input of a polymer synthesizer for subsequent use in that same step. Recycling processes the outflow from one or more steps of polymer synthesis to restore original concentrations or purity levels for use in a later synthesis run. Quality control analysis may determine if outflow collected from a polymer synthesizer is reused or recycled. These techniques reduce reagent cost and waste quantity. These techniques may be used with phosphoramidite or enzyme-based synthesis of deoxyribonucleic acid (DNA).

Reuse and recycling for polymer synthesis

Waterjet systems including control valves and associated devices, systems, and methods are disclosed. A waterjet system configured in accordance with a particular embodiment includes a fluid source, a jet outlet, and a fluid conveyance extending from the fluid source to the jet outlet. The system further includes a control valve positioned along the fluid conveyance downstream from the fluid source and upstream from the jet outlet. The fluid conveyance has a first portion upstream from the control valve and a second portion downstream from the control valve. The control valve is configured to controllably reduce a pressure of fluid within the second portion of the fluid conveyance relative to a pressure of fluid within the first portion of the fluid conveyance. The first portion of the fluid conveyance is configured to accommodate movement of the jet outlet relative to the fluid source.

Control valves for waterjet systems and related devices, systems, and methods

Disclosed is a cooling assembly for circuit boards. In one embodiment, the assembly includes a circuit board that is thermally and physically coupled to a heat spreader by a thermal interface. In one configuration, the circuit board is formed from a semiconductor material and includes a first board surface on which integrated circuits are mounted and a second board surface opposite the first board surface. The heat spreader is formed from a thermally conductive material and includes a plurality of vanes that are spaced apart from one another. The thermal interface is coupled between at least one area of the second board surface of the circuit board and a contact area of each of the plurality of vanes. Heat generated by the integrated circuits is conducted from at least one integrated circuit to the plurality of vanes of the heat spreader through the circuit board and the thermal interface.

Conduction cooling for circuit boards

Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.

Systems and associated methods for controllably cooling computer components

Growing community of inventors

Redmond, WA, United States of America

Douglas Patrick Kelley