Hutchinson Technology Corporation

Mound Laser & Photonics Center, Inc.

Mmi Technologies Pte Ltd.

Douglas P Riemer

Peter Francis Ladwig

Michael Wayne Davis

Kurt C Swanson

Paul Valentine Pesavento

Clark T Olsen

Mark A Miller

Dean E Myers

Duane M Jelkin

Matthew S Lang

John L Schumann

Steven A Fank

Steven R Lagergren

Joseph D Starkey

Zachary A Pokornowski

Bryan John Scheele

Craig A Leabch

John A Theget

Donald M Anderson

Shawn P Bopp

Andrew R Dick

Jeffery D Weckwerth

Stephen J Hansen

Stephen P Toperzer

Kurt F Fischer

Matthew J Horner

David A Brouchous

Keith D Johnson

Dylan S Johnson

Donovan D Turvold

James J Sherry

Christopher R Rosenau

Gowtham V Vangara

Collin M Grove

Treatment solutions and methods for treating a substrate including forming a first layer on a surface of the substrate, providing a process gas to the one or more plasma sources, the process gas includes a gas mixture of a reactive gas species and an inert gas species; forming a plasma under vacuum in the one or more plasma sources; and exposing the substrate to the plasma under vacuum to treat the first layer on the surface of the substrate.

Surface treatment producing high conductivity vias with simultaneous polymer adhesion

Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.

High aspect ratio electroplated structures and anisotropic electroplating processes

A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Miniature pressure/force sensor with integrated leads

A neutralizing composition comprising ascorbic acid as a reducing agent, citric acid as a chelator and a pH adjusting agent applied to microetched copper substrates bussed to stainless steel, which have been cleaned with an agent comprising permanganate ions. Unlike the prior art neutralizing agents comprising oxalic acid, which leave insoluble residue on the surface of the copper substrate, the present neutralizing composition leaves no residue and acts quickly. A surprising reduction in defects of Ni—Au plated copper substrates is achieved by utilization of the neutralization composition in a manufacturing process.

Microetch neutralizer chemistry for Ni—Au plating defect elimination

A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.

Gold electroplating solution and method

A battery pouch is described. The battery pouch including an outer layer and an inner layer disposed on the outer layer. The inner layer including at least one sensor.

Sensored battery pouch

A suspension assembly is described. The suspension assembly including a rigid interposer circuit; a plurality of flexible circuits configured to attach to the rigid interposer circuit and movable about an x-axis and a y-axis with respect to the static plate; and a sensor mounting region on the rigid interposer circuit.

Sensor shift structures in optical image stabilization suspensions

A suspension assembly is described. The suspension assembly including a static member or plate; a moving member or plate movable about an x-axis and a y-axis with respect to the static plate; a sensor mounting region on the moving plate; and one or more shape memory alloy (SMA) elements extending between and coupled to the static plate and moving plate. The SMA elements, when driven by a controller, move the moving plate and the sensor mounting region thereon about the x-axis and the y-axis with respect to the static plate.

Etchant solutions, pretreatment and methods for etching electroless nickel on metallic materials are provided herein. More specifically, etchant solutions for selectively removing electroless nickel from the surface of metallic materials containing copper, and optionally as containing stainless steel, methods of etching and pretreatment are provided.

Electroless nickel etch chemistry, method of etching and pretreatment

Treatment solutions and methods for improving adhesion of gold electroplating onto metal surfaces are provided herein. More specifically, the disclosure relates to micro-etching stainless steel surfaces using to remove any organic contamination and chromium oxide formed on the surface, neutralize and strip the surface of any iron content, and repassivate the surface with a thin chromium oxide layer, prior to gold electroplating of the stainless steel surfaces.

Treatment methods and solutions for improving adhesion of gold electroplating on metal surfaces

An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.

Etch chemistry for metallic materials

Electric tabs and methods for manufacturing are described. A method includes disposing a dielectric layer on a second side of a base material, the base material having a first side and the second side. The method including developing the dielectric layer on the second side of the base material. And, the method including etching the first side of the base material to form an electrode tab.

Electrode tabs and methods of forming

Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. In embodiments, the attachment structures include a first portion and a second portion configured to be crimped together. In embodiments, at least one of the first and second portions include an etched recess.

Shape memory alloy wire attachment structures for a suspension assembly

A system for electroplating a web of conductive material with a source material comprises a transport mechanism, an electrical contact, a plating bath, and at least one nozzle. The transport mechanism transports the web through the system. The electrical contact electrically engages the web to cause current to flow into the web. The plating bath contains a volume of an electrically conductive liquid contain ions of the source material. The nozzle is configured to flow a low electrical conductivity fluid onto the web. A portion of the web is immersed in the electrically conductive liquid. The current flowing in the web causes the ions of the source material in the electrically conductive liquid to attach to a surface of the portion of the web.

Growing community of inventors

Waconia, MN, United States of America

Douglas P Riemer