Intel Corporation

Integrated Process Equipment Corporation

Douglas P Kreager

Thomas A Repko

Frank W Joyce

Teik Sean Toh

Brian A Wilk

Say Cheong Gan

Chanh Le

Yoong Li Liew

Junedong Lee

A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.

Support system for semiconductor wafers

A method for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The method is implemented via an apparatus that enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1-4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

Automated circuit board test actuator system

An apparatus for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The apparatus enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1-4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

A method includes placing a circuit board on a test sheet so that conductive pins on an underside of the circuit board are in electrically conductive contact with electrically conductive contact pads on an upper surface of the test sheet. The test sheet includes connectors at a periphery of the test sheet. The connectors couple the test sheet to test signal generating devices. The method further includes applying test signals to the circuit board via the test sheet. Other embodiments are described and claimed.

Methods and apparatus for testing circuit boards

An apparatus and method for automatically testing circuit boards, such as computer system boards and the like. The circuit board device under test (DUT) is loaded into an automated test apparatus (tester), which includes a mechanism for automatically connecting test electronics to various DUT circuitry and I/O ports via corresponding connectors on the DUT. A type of DUT is identified, and a corresponding set of tests are performed to verify the operation of the DUT. Appropriate power signals and sequencing are also applied to the DUT, as defined by it type. Data logging is performed to log the results of the testing. The apparatus includes replaceable probe/connector plates that are DUT-type specific and corresponding universal electronics and cabling to enable a variety of different board types to be tested with the same apparatus.

Universal automated circuit board tester

Support system for semiconductor wafers and methods thereof

An apparatus and method for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The apparatus enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1&#x2013;4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

A flexible conditioning apparatus and method for uniformly conditioning a polishing surface of a pad used to remove undesirable irregularities from a silicon wafer and to achieve a planar condition of the polishing pad. In a preferred embodiment of the present invention, a roughening member comprising a plurality of point contacts, such as diamond particles, is adapted for movement into and out of engagement with the surface of the pad. A flexible member supporting the roughening member allows the roughening member to conform to the surface of the pad to achieve uniform polishing of the pad.

Growing community of inventors

Lake Oswego, OR, United States of America

Douglas P Kreager