Ljl Biosystems, Inc.

Affymetrix, Inc.

Molecular Devices Corporation

Verigy (singapore) Pte. Ltd.

Nanonexus Corporation

Other

Bio-rad Laboratories, Inc.

Digital Equipment Corporation

Affymax Technologies, N.v.

Optical Sensor Consultants, Inc.

Douglas N Modlin

Glenn R Edwards

Amer El-Hage

Christopher J Buchko

James L Winkler

Lois Aldwin

Samuel Ascher Marquiss

John C Owicki

Debra A Ross

David P Stumbo

Fu Chiung Chong

Michael T Taylor

Todd E French

Jon F Petersen

Stephen P A Fodor

Sammy Mok

Samuel Burd

Lev J Leytes

Rick V Stellmacher

Stephen P Fodor

Nitin S Parekh

Frank Swiatowiec

Douglas J McKay

Andrew Kao

Anna Litza

Zhaohui Shan

Phillip Belgrader

Jr Makarewicz Anthony Joseph

Benjamin Joseph Hindson

Donald Arthur Masquelier

Kevin Dean Ness

Kevin D Ness

Alejandro C Zaffaroni

Benjamin J Hindson

Donald Masquelier

Billy Wayne Colston, Jr

Fred Paul Milanovich

Christopher G Cesar

Vincent Riot

Anthony Joseph Makarewicz, Jr

Joseph S Leytes

Wilmer R Bottoms

Philip A Granieri, Jr

William G Burton

Derrick A Richardson

Jr Colston Billy Wayne

Craig S Barker

Vladimir Lemberg

John W Meadows

Jonathan Petersen

Joseph Michael Haemer

Yong Paik

Deng-Yuan Fu

Joel Parke

Robert M Lembi, Sr

Lorne B Bechtel

Carl L Wright

James S Richey

Enal S Razvi

Calvin D Wong

Jeanne A Ruiz

Lorne E Bechtel

Ley J Leytes

Jan Frederik Jansen

Billy Wayne Colston

Anthony Joseph Makarewicz

Billy Wayne Jr Colston

Methods of partition-based analysis. In an exemplary method, a device having a port fluidically connected to a chamber may be selected. A sample-containing fluid may be placed into the port. The sample-containing fluid may be moved from the port to the chamber. Partitions of the sample-containing fluid may be formed. A monolayer of the partitions in the chamber may be created. At least a portion of the monolayer may be imaged.

Partition-based method of analysis

Systems, including apparatus and methods, for performing assays. These systems may involve separating sample components by partitioning them into droplets or other partitions, amplifying or otherwise reacting the components within the droplets, detecting the amplified components, or characteristics thereof, and/or analyzing the resulting data, among others.

Droplet-based assay system

An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

High density interconnect system having rapid fabrication cycle

An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.

High density interconnect system for IC packages and interconnect assemblies

A method and device for forming large arrays of polymers on a substrate (). According to a preferred aspect of the invention, the substrate is contacted by a channel block () having channels () therein. Selected reagents are delivered through the channels, the substrate is rotated by a rotating stage (), and the process is repeated to form arrays of polymers on the substrate. The method may be combined with light-directed methodologies.

Combinatorial strategies for polymer synthesis

A method and device for forming large arrays of polymers on a substrate (). According to a preferred aspect of the invention, the substrate is contacted by a channel block () having channels () therein. Selected reagents are delivered through the channels, the substrate is rotated by a rotating stage (), and the process is repeated to form arrays of polymers on the substrate. The method may be combined with light-directed methodolgies.

Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a stiffening structure and a compliant carrier structure, such as a decal or screen, which is fixedly attached to the probe chip substrate.

Enhanced compliant probe card systems having improved planarity

Broad-range light-detection systems, including components and methods of use thereof. These systems may include apparatus and methods for detecting light with increased speed and/or detection efficiency, particularly in applications involving repeated analysis of the same sample and/or successive analysis of different samples, and particularly when the sample or samples have a wide range of light intensities. These systems also may include apparatus and methods for detecting light with increased accuracy over a broad range of intensities. These systems also may include vapparatus and methods for automatically scaling detection range to improve detection based on the intensity of the detected light.

Broad range light detection system

Systems, and components thereof, for analyzing samples. These systems include apparatus and methods for generating, transmitting, detecting, and/or analyzing light, including without limitation high-throughput optical screening devices for analyzing samples at one or more assay sites. These systems also include apparatus and methods for supporting samples for analysis, including without limitation multiwell sample holders such as microplates.

Sample analysis systems

A method for producing arrays by spacing a dispenser a distance from a surface of a support, dispensing a volume containing a compound in a single coupling step of less than 5 nl to occupy a localized area of less than 1 cmof the surface of the support, allowing the compound to bind directly or indirectly to the support and repeating the steps to produce an array of at least 100 ligands at a density of 1000 per cmor greater.

The invention provides an integrated sample-processing system and components thereof for preparing and/or analyzing samples. The components may include a transport module, a fluidics module, and an analysis module, among others.

Integrated sample-processing system

A method for producing polymer arrays by spacing a dispenser a distance from a surface of a support, dispensing a volume containing a monomer in a single coupling step of less than 5 nl to occupy a localized area of less than 1 cmof the surface of the support, allowing the monomer to bind directly or indirectly to the support and repeating the steps to produce an array of at least 100 polymer ligands at a density of 1000 per cmor greater.

Growing community of inventors

Palo Alto, CA, United States of America

Douglas N Modlin