Silicon Graphics, Incorporated

Cray Research, Inc.

Douglas M Carlson

Edward A Malosh

William Berg

Karl Hokanson

The present invention relates to an improved system and method for cooling electronic devices. The present system is particularly adapted for cooling computer equipment. The system comprises a sealed enclosure which houses one or more heat generating electronic devices; a blower; and a heat exchanger. The sealed enclosure may be pressurized with a gas medium such as dry nitrogen up to a pressure of approximately two atmospheres. The elevated pressure increases the gas density, effectively increasing the mass flow rate and heat carrying capacity of the gas. The blower is also a constant volume device such that it can move the same volume of gas regardless of density. Accordingly, for a given heat load, the size of the blower may be reduced. Or, alternatively, a given blower can cool a device having a higher heat load. Finally, by pressurizing the enclosure, the present invention eliminates the need to size a forced air cooling system based on high elevation requirements.

High performance gas cooling system and method

A heat sink is disclosed having an elongate, porous metal structure, including multiple sets of thermally conductive members. The members, which are interwoven, direct heat away from a heat producing component. The elongate structure of the matrix structure can be formed in a variety of predetermined forms, including a coiled structure or an elliptically coiled structure. Alternatively, the matrix structure is plated for added thermal conductivity between the sets of members. In addition, air flow is directed over the heat sink for added convection of heat. The heat sink is fabricated using a mesh of thermally conductive material such as copper or aluminum and can be provided with a plurality of protuberances. The heat sink is thermally bonded to the heat producing component. Alternatively, the heat sink has a ledge for sealing with a duct. A method for cooling a heat producing component is also disclosed. The method includes the steps of providing a heat sink structure as above, thermally coupling the heat sink structure to a heat producing component, and directing a fluid flow over the heat sink structure.

Growing community of inventors

Eau Claire, WI, United States of America

Douglas M Carlson