Motorola Corporation

Emerson Network Power - Embedded Computing, Inc.

Artesyn Embedded Computing, Inc.

Douglas L Sandy

Robert Charles Tufford

Jeffrey Martin Harris

Martin Peter John Cornes

Suzanne Marye Wong

Ross L Armstrong

Nitin B Sharma

Charles Christopher Hill

Mark S Lanus

Shlomo Pri-Tal

Scott J Fabini

A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided.

Thermal conduction to a cylindrical shaft

A canister system having a cylindrical housing, having at least one enclosed end, and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system including an input/output device extending along at least a portion of the modular electronic rack system. The modular electronic rack system further having a power input and a signal output electrically coupled to the input/output device&#x2014;at least one of the power input and the signal output extending through the at least one enclosed end of the cylindrical housing at a first sealed terminal. The canister system further having a first alignment system for physically aligning an electronic connection with the sealed terminal. The electronic connection having physically engaging features extending from the cylindrical housing to align the electronic connection therewith.

Alignment mechanism for cabling to a cylinder head

A ruggedized canister system having a cylindrical housing and a modular electronic rack system disposed therein. The modular electronic rack system includes a backplane and a plurality of rib members radiating outwardly from the backplane. The rib members extend from the backplane at a proximal end in a direction generally orthogonal to the longitudinal axis of the backplane toward a distal end. An input/output device extends along at least a portion of the backplane and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots are positioned within a space define by the rib members when viewed in plan view. Each of the electronic slots is configured to physically and operably receive an electronic card. Each of the electronic slots is electrically connected to the input/output device for electrical communication between the electronic card and the input/output device.

Modular electronics for cylinders

A system comprises an input and a hardware description language (HDL) module. The input receives design specifications for a custom circuit board. The design specifications are selected from predetermined design options for custom circuit boards. The hardware description language (HDL) module generates HDL corresponding to the design specifications and outputs the HDL to a circuit board producer.

Hardware description language (HDL) generation systems and methods for custom circuit boards

A method of transporting a RapidIO packet () from an initiator RapidIO domain () over an IP packet network () to a receiver RapidIO domain () can include the initiator RapidIO domain creating the RapidIO packet and reading a destination domain ID () of the RapidIO packet, where the destination domain ID corresponds to the receiver RapidIO domain. The destination domain ID is mapped to a receiver RapidIO domain IP address (). The RapidIO packet is encapsulated in an IP packet () and the IP packet is communicated to the receiver RapidIO domain over the IP packet network.

Method of transporting a RapidIO packet over an IP packet network

A multi-service platform system, includes a backplane (), a switched fabric () on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module () has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector. A storage module () is coupled to the payload module, where the storage module is coupled to communicate with the switched fabric.

Fabric enabled storage module

A configurable switching device includes a switch card coupled to interface with a backplane of a computer chassis, a plurality of PCI-Express switching elements coupled to the switch card, and a configuration means coupled to the switch card, where the configuration means is operable to configure and reconfigure the plurality of PCI-Express switching elements to operate in a plurality of directional fabric domains, and where each of the plurality of PCI-Express switching elements can operate in only one of the plurality of directional fabric domains at a time.

Re-configurable PCI-Express switching device

A switched fabric mezzanine storage module () includes a storage module () and a switched fabric connector () coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (), where the switched fabric storage mezzanine module is coupled to a payload module () having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector () coupled to a rear edge () of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane ().

Switched fabric mezzanine storage module

A multi-service platform system, includes a backplane (), a switched fabric () on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module () has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Payload module having a switched fabric enabled mezzanine card

A payload module () includes a payload subunit () coupled to the payload module, where the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module and to the payload subunit, where the at least one multi-gigabit connector is coupled to communicatively interface the payload subunit to a backplane (), where the backplane includes a switched fabric () coincident with at least one of a VMEbus network and a PCI network, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload subunit through the at least one multi-gigabit connector. A payload module power connector () includes a plurality of pins (), where at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between a main power bus () on the backplane and a payload module power bus () on the payload module is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period (), where power and any concurrent data operations on the backplane remain uninterrupted and unaffected during the at least one of applying and removing power between the main power bus and the payload module power bus.

Multi-network modules with hot-swap capability

In a distributed switch fabric network () having a first node () having a first node transceiver port () and a second node () having a second node transceiver port (), link level flow control () operating between the first node transceiver port and the second node transceiver port to in response to a congestion condition () in the second node transceiver port, wherein the link level flow control suspends transmission of one of a plurality of priority levels of packets () on a channel from the first node transceiver port to the second node transceiver port. The one of the plurality of priority levels of packets accumulates in one of a plurality of a transmit buffers () of the first transceiver port, where the one of the plurality of transmit buffers corresponds to the one of the plurality of priority levels of packets. Per-flow flow control () operates to modify transmission of the one of the plurality of priority levels of packets to the transmit buffer if the transmit buffer reaches a transmit threshold value (). Link level flow control operates transparently to a traffic manager () of the first node if the congestion condition occurs and the one of the plurality of transmit buffers fails to reach the transmit threshold value.

Method of quality of service based flow control within a distributed switch fabric network

A multi-service platform system () includes a computer chassis () having a plurality of 3U slots (), a backplane () integrated in the computer chassis, a switched fabric () on the backplane. At least one of a VMEbus network and a PCI network are coincident with the switched fabric on the backplane. A payload module () having a 3U form factor is coupled to interface with one of the plurality of 3U slots, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

3U payload module configurations

A bladed architecture, backplane-based network () having N payload slots () includes an N/2 slot switch module (), wherein the N/2 slot switch module is reconfigurable to one of a left-hand slot switch configuration () and a right-hand slot switch configuration (), and wherein the N/2 slot switch module is coupled to N/2 of the N payload slots such that the bladed architecture, backplane-based network is in a sub-optimal configuration ().

N/2 slot switch module

A switch module includes a board () having one of a 3U form factor and a 9U form factor, and a central switching resource () coupled to the board, where the central switching resource is coupled to operate a switched fabric () on a backplane (), where the switched fabric operates coincident with at least one of a VMEbus network and a PCI network on the backplane.

Switch module having one of 3U and 9U form factor

A stacked 3U payload module unit () includes a base module (), where the base module has a 3U form factor (), and where the base module is coupled to directly communicate with a switched fabric () on a backplane () of a computer chassis (), where the backplane comprises the switched fabric and a VMEbus network () operating concurrently. Stacked 3U payload module unit () can also include a stacking module () coupled to the base module, wherein the stacking module has the 3U form factor, wherein the stacking module is communicatively coupled to the base module through a stacking switched fabric connector (), and wherein the stacking module is communicatively coupled to the switched fabric via the base module and the stacking switched fabric connector.

Growing community of inventors

Chandler, AZ, United States of America

Douglas L Sandy