Satcon Technology Corporation

Douglas L Johnson

Evgeny N Holmansky

Edward J Ognibene

Kevin J Donegan

A fluid cooling device, and a method for manufacturing the fluid cooling device, are disclosed. The fluid cooling device includes a plurality of cold plate members, each having a plurality of imperforate plate portions and perforate portions arranged in a line; and, at least one connector for connecting the plate portions together at one end thereof. The cold plate members are arranged in a stack, wherein respective plate portions of each cold plate member are in registration with perforate portions formed in its adjacent cold plate members in the stack. The fluid cooling device can provide very high heat transfer by close clearance laminar developing flow, thereby increasing the thermal performance of the fluid cooling device while maintaining low pressure drop. The method for manufacturing the fluid cooling device includes forming a plurality of cold plate members from a planar metal tape, or thin layer stock; positioning the cold plate members relative to each other so that the respective imperforate plate portions of each cold plate member are in registration with the perforate portions formed in adjacent cold plate members; and joining each cold plate member with the adjacent cold plate members.

High performance cold plate for electronic cooling

A high-density, staggered pin fin array, and a method for manufacturing the pin fin array, are disclosed. The pin fin array includes a plurality of fin members, each having a plurality of elongated, pin-shaped fins arranged in a row; and, at least one connector for connecting the fins together, each at one end thereof. The plurality of fin members is arranged in a stack, wherein respective fins of each fin member are in registration with slots formed in its adjacent fin members in the stack. The method for manufacturing the pin fin array includes forming a plurality of fin members from a raw planar, tape, or thin layer stock, positioning the fin members relative to each other so that the respective fins of each fin member are in registration with the slots formed in adjacent fin members, and joining each fin member with the adjacent fin members. The high-density, staggered pin fin array produces very high heat transfer coefficients by geometrically inducing turbulent mixing, thereby increasing the thermal performance of the pin fin array.

Growing community of inventors

Georgetown, MA, United States of America

Douglas L Johnson