Arm Limited

Douglas James Joseph

Saurabh Pijuskumar Sinha

Alejandro Rico Carro

Tiago Rogerio Muck

Various implementations described herein refer to a device having a multi-layered logic structure with multiple layers including a first layer and a second layer arranged vertically in a stacked configuration. The device may have a first network that links nodes together in the first layer. The device may have a second network that links the nodes in the first layer together by way of the second layer so as to reduce latency related to data transfer between the nodes.

Multi-dimensional routing architecture

Various implementations described herein are directed to device. The device may include a first tier having a processor and a first cache memory that are coupled together via control logic to operate as a computing architecture. The device may include a second tier having a second cache memory that is coupled to the first cache memory. Also, the first tier and the second tier may be integrated together with the computing architecture to operate as a stackable cache memory architecture.

Growing community of inventors

Leander, TX, United States of America

Douglas James Joseph