Htc Corporation

Other

Emhart Industries, Inc.

Usm Corporation

Dynapert-htc Corp.

Douglas J Peck

Donald J Spigarelli

James L Finney

Walter J Hall

A universal metal working kit is described. The kit has a plurality of interchangeable elements that combine with a master bushing to perform different workpiece locating and holding functions and objectives.

Kit of interchangeable workpiece locating and holding elements

The level of vapor generated by heaters located in boiling electronic liquid contained in a vessel is maintained at a first level below the path of travel of work product and is elevated to a second level above the work product to process the work product. After a selected processing time the vapor level is lowered to the lower level so that the work product will not be overheated.

Vapor phase processing system

A processing vessel has two adjacent tanks each holding different electronic liquids. When heated the first will generate saturated vapor having a temperature below the liquidus temperature of eutectic solder and the second, when heated, will generate saturated vapor having a temperature above the liquidus temperature of eutectic solder. Work product is sequentially passed through these vapors and is first preheated and then reflowed.

Vapor phase soldering system

A vapor phase system for soldering of a workpiece. A vessel for containing an electronic liquid which is heated to generate a zone of saturated vapor. A first inclined throat communicates with the vessel and a solder pot is located within the vessel. The solder pot including a reservoir for containing molten solder, a second throat aligned with the first throat and communicating at one end with molten solder contained in the reservoir means and communicating at the other end with the saturated vapor, molten solder contained in the reservoir means is pumped through the second throat and is captured by the reservoir and a conveyor carries work product through the first throat, through the saturated vapor and into the second throat whereby the work product will become immersed in the molten solder contained within the second throat.

Apparatus for solder removal

A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

Continuous solder system

A single vapor system for soldering, fusing, or brazing includes vertically disposed chambers which provide a draining and drying zone above a vapor processing zone. Draining occurs in the upper zone with no additional heat being added in vapor recovery. A sealing system is utilized which is actuated by the carrier elevator as an article-carrying basket is moved into and out of the zones. The sealing system includes a moveable top cover resting on the top of the article-carrying basket, with the top cover being left at the top of the draining and drying zone to seal the top of this zone when the basket is lowered to the bottom of this zone. A moveable bottom plate is raised by pulleys and weights, spring returns or other means to the bottom of the draining and drying zone such that the bottom plate seals the bottom of this zone, isolating the zones one from the other. Liquid drained from the article in the upper zone flows into a peripheral channel at the bottom plate to provide a liquid seal around the perimeter of the bottom plate. An unheated primary vapor recovery system and a combined system vent and unheated secondary recovery system are utilized for the draining and drying zone. In one embodiment, the carrier elevator includes basket-lowering straps or tapes which pass through cylindrical or square channels carried by the top plate, with the channels carrying slit and chamfered discs for prevention of vapor leakage at the points where the tapes pass through the top plate. In a completely automated embodiment, the carrier elevator is provided with an endless horizontal belt, with the belt being driven only when the carrier reaches the load/unload position.

Single vapor system for soldering, fusing or brazing

A solder leveling system for use in vapor phase soldering of printed wiring boards. A transport system operating in a near-horizontal mode moves the board to be solder coated through a vapor zone in a chamber having a solder pot which has a throat in line with the plane of the transport system. The near-horizontal movement through the vapor and into and out of the solder pot prevents solder sag and permits control of the thickness of solder deposited on the opposing board surfaces. Leveling nozzles are positioned in a vapor-filled chamber astride the transport system between the solder pot and the chamber throat. Perpendicular nozzle offset distance from the board and nozzle angle are adjustable. Preferably one nozzle projects a stream normal to the board, with the other nozzle projecting a grazing stream for clearing through holes. A nozzle flow rate corresponding to a predetermined energy threshold provides reliable hole clearing. Preferably the chamber throat is cooled for vapor containment, forming one of three cooling zones for vapor containment, vapor leveling, and condensation. In the preferred solder pot, as the board enters the sloping throat, solders spills over a weir into a reservoir from whence it is pumped into a standpipe which charges the sloping throat. Preferably solder is added to the pot through a drop tube having a lower end immersed in the solder to provide a unique vapor seal and means for determining the level of solder. A preferred transport system utilizes a spring loaded carrier providing easy loading and unloading of the boards.

Growing community of inventors

North Andover, MA, United States of America

Douglas J Peck