International Business Machines Corporation

Rainbow Displays, Inc.

Douglas H Strope

Thomas E Wray

Voya Rista Markovich

Natalie Barbara Feilchenfeld

Dean W Skinner

Raymond G Greene

William T Chen

Allen Frederick Moring

Peter A Moschak

William J Amelio

Yifan Guo

Jennifer M Cohen

Peter A Engel

Kishen N Kapur

William J McCarthy

George Dean Ogden

Lawrence P Brehm

Robert C Seward

A large, efficient, high power collimated backlight assembly has a highly reflective, substantially closed, thin rectangular light cavity containing highly reflective surfaces and one or more light sources. One of the large faces of the cavity is a light exit plate which contains a transmissive, light collimating structure. The cavity side of the collimating structure includes a highly reflective white planar structure containing an array of circular apertures with minimal sidewall absorption. The apertures are centered on the optical axis and located near the focal distance of a closely packed array of hemispherical or spherical lenses located on the outer surface of the collimating structure. Light rays are trapped between the highly reflective surfaces of the cavity, light sources, and aperture walls, until they enter the lenses, which output the majority of rays that enter in a collimated beam. The backlight assembly is advantageously used for transmissive type electro-optical displays, especially those whose performance is enhanced by efficient collimated light, such as seamless tiled liquid crystal displays.

Backlight assembly for collimated illumination

Registration of the layers in a multilayer electronic device is tested and measured by X-ray moire interferometry.

Testing laminates with x-ray moire interferometry

A fiber optic data transmission system and method are provided comprising a laser diode, an attenuating and focusing lens, and an optical fiber. The method of operating the system attenuates laser diode radiation outputted during operation. The system operates by application of the input driving current to the laser diode in a manner which increases the laser diode extinction ratio. The increased laser diode power output associated with operation at a higher extinction ratio is attenuated by the lens to a safe operating level. Increasing the laser diode extinction ratio significantly increases the system's signal-to-noise ratio and thereby reduces the bit error rate associated with the data transmitted over the optical fiber, while the attenuation of the laser diode output radiation allows operation within prescribed safety limits.

Fiber optic transmitter modification for improved extinction ratio

Reinforced synthetic polymer composite is treated by heating at a temperature and for a time sufficient to obtain a moisture content below that for the relative humidity level at which the composite is to be drilled and/or photoresist exposed; and then subjecting it to conditions to increase the moisture content to that for the relative humidity level of the drilling.

Process for treating reinforced polymer composite

A conductive film deposition rate monitoring method for measuring the real time deposition rate of a metallic deposition process particularly an electroless plating bath, including the steps of positioning an eddy current detector within a predetermined distance of a test surface where the deposition is to be deposited, and the step of monitoring the output of the detector. The apparatus comprises an eddy current sensor and a non-metallic housing for the sensor, having a non-conductive wall of predetermined thickness between the sensor and the surface of the wall distant from the sensor, the distant wall being immersed in the deposition environment, such as a plating bath, so that a deposit takes place on the distant surface, and measuring means connected to the output of the sensor for measuring the amplitude and rate of change of the output of the sensor.

Method for monitoring deposition rate using an eddy current detector

A displacement compensating module is disclosed wherein a blocking article, such as a polyimide tape, is disposed between an epoxy composition and the back surface of a substrate and between the epoxy composition and the inner surface of a cap for blocking the movement of the epoxy composition into a gap area during the manufacture of the module. An electronic module comprises a substrate, an integrated circuit chip disposed on the substrate, a cap disposed over and enclosing the chip and the substrate, a heat dissipator disposed between the cap and the chip for carrying away the heat dissipated by the chip, and an epoxy composition secured to the back surface of the substrate for sealing the module, and specifically, the chip within the module from harmful external influences. The boundary of a gap is defined by the edge of the substrate and the inner surface of the cap. A blocking article, such as a polyimide tape, is disposed between the epoxy composition on one side and the back side of the substrate coupled with the inner surface of the cap on the other side for holding the epoxy composition external to the gap and preventing the epoxy composition from being disposed within the gap during the manufacture of the module. As a result, the cap is relatively free to move with respect to the substrate. Unnecessary distortion of the cap is minimized and resultant damage to the chips within the cap is avoided.

Displacement compensating module

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Apalachin, NY, United States of America

Douglas H Strope