Lam Research Corporation

Ontrak Systems, Inc.

Douglas Grant Gardner

Brian M Bliven

John Martin De Larios

Stephen Mark Smith

Mikhail Ravkin

An edge roller assembly includes first and second grip rings. The grip rings are held together in an opposing relationship such that outer surfaces thereof define a groove for receiving an edge of a substrate. The grip rings may be O-rings formed of a rubber material. In one embodiment, the grip rings are held together by lower and upper clamp plates that are adjustably fastened together so that the clamping forces exerted on the substrate can be controlled. The upper clamp plate may have a height adjustment knob for adjusting the height of the edge roller assembly mounted thereon. A method for contacting an edge of a substrate and a transport system for transporting semiconductor wafers to a wafer processing station also are described.

Edge roller assembly, method for contacting an edge of a substrate, and transport system for transporting semiconductor wafers to a wafer processing station

A brush core and method of making a brush core are provided. The brush core is configured to be implemented in substrate preparation systems. The brush core is connected between a first end and a second end of a non-rotating shaft. A motor is contained within the brush core for rotating the brush core around the non-rotating shaft. The first end and the second end are each capable of being adjusted to calibrate and position the brush core. The calibrated position of the brush core can be set to compensate for a skewed substrate, or to achieve a desired pressure application profile over the substrate.

Wafer scrubbing brush core having an internal motor and method of making the same

A Method and Apparatus for Chemical Delivery Through the Brush used in semiconductor substrate cleaning processes. The chemical solutions are delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate, reduces the volumes of chemical solutions used in a scrubbing process, and helps maintain control of the pH profile of a substrate. This system is described and illustrated in the manner it is used in conjunction with a scrubber that scrubs both sides of a semiconductor substrate.

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Milpitas, CA, United States of America

Douglas Grant Gardner