Starkey Laboratories, Inc.

Douglas F Link

David Prchal

Sidney A Higgins

Craig Dumas

Robert P Jacoby

Ay Vang

Shawn Mahon

Kevin Lammi

Susan Marie Johansson

John Dzarnoski

Sayed Kaysarbin Rahim

Yike Wang

Susie Krzmarzick

A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.

Hearing aid adapted for embedded electronics

Various embodiments of an integrated circuit module and a method of forming such module are disclosed. The module includes a first die having an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate. The module also includes a second die having a first major surface, a second major surface, and a conductive pad disposed on the second major surface. The second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.

Integrated circuit module and method of forming same

A hearing assistance device comprises a system in package (SIP) disposed within an enclosure. The SIP module comprises a first substrate having a first surface and an opposing second surface, the first substrate supporting a first subsystem configured to perform a first function. A second substrate has a first surface and an opposing second surface, the second substrate supporting a second subsystem configured to perform a second function. The second surfaces face each other and at least one of the second surfaces supports one or more components. An interconnect layer is separate from and bonded to and between the first and second substrates. The interconnect layer comprises a window and a region peripheral to the window. The window is sized to accommodate the one or more components and the peripheral region comprising electrical pathways for electrically connecting the first subsystem and the second subsystem.

Hearing assistance device incorporating system in package module

Disclosed herein, among other things, are systems and methods for improved circuit design for hearing assistance devices. One aspect of the present subject matter includes a hearing assistance device configured to compensate for hearing losses of a user. The hearing assistance device includes a substrate and an interposer embedded into the substrate to form a system in package module. According to various embodiments, the interposer includes one or more integrated circuits (ICs) on the interposer, the one or more ICs configured to provide electronics for the hearing assistance device.

Interposer stack inside a substrate for a hearing assistance device

Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.

Solderless hearing assistance device assembly and method

The present subject matter relates to a hearing assistance device for an ear of a wearer comprising a microphone for receiving sound, hearing assistance electronics in communications with the microphone, the hearing assistance electronics including a hybrid circuit, and a wearable housing adapted to house at least the hearing assistance electronics. The hybrid circuit comprises a first integrated circuit die having one or more through-silicon-vias (TSVs), a first redistribution layer disposed on a surface of the first integrated circuit, and a second integrated circuit die having one or more contacts, the second integrated circuit die disposed on the first redistribution layer, wherein the first redistribution layer is adapted to connect one or more of the one or more TSVs of the first integrated circuit die to one or more of the one or more contacts of the second integrated circuit die.

Growing community of inventors

Plymouth, MN, United States of America

Douglas F Link