Cooligy, Inc.

Liebert Corporation

Vertiv Corporation

Douglas E Werner

Richard Grant Brewer

Norman Chow

James Hom

Mark Munch

Mark McMaster

Brandon R Leong

Girish Upadhya

Paul Tsao

Adrian Correa

Tien Chih (Eric) Lin

Ian G Spearing

Tien-Chih Lin

Tim Schrader

Gregory Shiomoto

Hae-won Choi

Frederic Landry

Thomas W Kenny

Peng Zhou

Ali Firouzi

Sudhakar Gopalakrishnan

Bruce R Conway

Zbigniew Cichocki

Tien-Chieh (Eric) Lin

Ian Spearing

A pumped refrigerant cooling system having cooling units with associated pumping units for providing working fluid to the cooling unit to enable cooling of a space. The pumped refrigerant cooling system also includes a redundant pumping unit which is activated when a primary pumping unit associated with a cooling unit becomes inactive. The primary pumping unit is deactivated in favor of the redundant pumping unit. Once the primary pumping unit is placed in a condition suitable for reactivation, the redundant pumping unit is deactivated, and the primary pumping unit is reactivated.

Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy

A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes multiple heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes one or more swivel joints, each configured to provide one or more fluid paths between the cooling door and the frame. The cooling door assembly includes separate and independent fluid paths, where fluid is separately provided to each independent fluid path. Different groups of heat exchangers are coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.

Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door

A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.

An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

Integrated liquid to air conduction module

The multi-layer tape wrapped tubing for effectively impeding the diffusion of vapor is made in a continuous in-line process and has three distinct layers: an inner tubing layer, a middle diffusion barrier layer and an outer jacketing layer. The inner tubing layer comes into contact with liquid and vapor. Vapor that might ordinarily diffuse through the tubing is impeded by the diffusion barrier layer. The diffusion barrier layer is a laminate comprising a diffusion barrier film with a very low vapor diffusion rate sandwiched between layers of thermoplastic. The diffusion barrier layer is wrapped around the inner tubing one or more times. The outer jacket layer is a polymeric jacket which is extruded onto the diffusion barrier layer wrapped inner tubing.

Tape-wrapped multilayer tubing and methods for making the same

The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

Internal access mechanism for a server rack

A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.

Deformable duct guides that accommodate electronic connection lines

One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

Gimballed attachment for multiple heat exchangers

Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

Liquid cooling loops for server applications

A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

A hermetic closed loop fluid system for controlling temperature of a heat source includes at least one component including at least one heat exchanger in contact with the heat source. The heat exchanger is configured to pass a fluid therethrough, wherein the fluid performs thermal exchange with the heat source. A predetermined amount of the fluid remains within the fluid system for a desired amount of operating time. The desired amount of operating time is preferably at least 10 years. Alternatively, the desired amount of operating time is at least 3 years. The predetermined amount of fluid is preferably ninety percent of an initial amount of fluid. Alternatively, the predetermined amount of fluid is seventy five percent of an initial amount of fluid. Still alternatively, at least fifty percent of the fluid can remain within the fluid system for the desired amount of operating time. The fluid can be a single phase fluid. The fluid can also be a two phase fluid.

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Santa Clara, CA, United States of America

Douglas E Werner