Arizona State University

Empire Technology Development LLC

Az Board of Regents, a Body Corporate of the State of Az Acting for and on Behalf of Az State University

Douglas E Loy

Emmett Howard

Shawn O'Rourke

Jesmin Haq

Michael Marrs

Nicholas Munizza

Scott Ageno

Robert Naujokaitis

Hanqing Jiang

David Morton

Robert Blanchard

R Steve Rednour

Disclosed are tactile keys and methods for their production and use. The tactile key may include a substrate; a conductive layer disposed on at least one region of the substrate; a porous layer disposed on at least a portion of the conductive layer; an insulating layer disposed on regions of the substrate that surround the conductive layer and the porous layer to form a well, the well having sidewalls defined by the insulating layer, and a bottom surface at least partially defined by the porous layer; an electroactive polymer composition disposed in the well; and a flexible layer having a conductive coating on at least a portion of a surface facing the electroactive polymer composition, the flexible layer covering the well and at least a portion of the insulating layer surrounding the well. When the tactile key is depressed, an electric field is activated causing the electroactive polymer composition to move towards the flexible layer to provide a tactile feedback.

Tactile keys and methods for their production and use

Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.

Method of providing a flexible semiconductor device and flexible semiconductor device thereof

Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.

Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom

Some embodiments can include a method of manufacturing first electronic device(s) and second electronic device(s), the method including: providing a carrier substrate having a first side and a second side, a first substrate bonded to the first side of the carrier substrate, and a second substrate bonded to the second side of the carrier substrate; depositing at least one layer of a first material over the first substrate while the first substrate is bonded to the first side of the carrier substrate to create a portion of the first electronic device(s); and depositing at least one layer of a second material over the second substrate while the second substrate is bonded to the second side of the carrier substrate to create a portion of the second electronic device(s). In many embodiments, the first substrate and/or the second substrate includes a flexible substrate. Other related systems and methods are also disclosed.

Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof

In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Method for manufacturing electronic devices and electronic devices thereof

Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing

Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.

The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates () post-processing without damage to fabricated devices.

Growing community of inventors

Chandler, AZ, United States of America

Douglas E Loy