Amoco Corporation

The Texas A&m University System

Douglas E Fjare

Neal R Nowicki

David J Fenoglio

John L Melquist

Edwin F Morello

Allyson J Beuhler

David A Wargowski

Marvin J Burgess

Herbert J Neuhaus

Cynthia A Navar

Gary P Hagen

Walter Partenheimer

Wen-Feng Liu

David P Sinclair

Weilong L Chiang

Robert T Roginski

Paul A Sanchez

Donald E Rubis

Terre L VanKirk

Neal B Nowicki

John T Hoback

Gayle G Chany

Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. The compositions are particularly useful in the manufacture of laminable films used to make printed wiring boards. Multilayer printed wiring boards made using such films, and methods for making and using the films and boards, also are disclosed.

Photoimageable compositions and films for printed wiring board manufacture

Polyimide optical waveguide structures comprising a core within a cladding wherein at least one of the core and the cladding is a polyimide containing 6FDA; and the complementary portion of the waveguide structure is a polyimide having partial replacement of the 6FDA of the core or cladding composition by BPDA, and wherein the difference in the birefringence of the core and cladding are less than the difference in the refractive index. Copolyimides containing 6FDA and BPDA moieties, and at least one diamine, which have properties useful in optical applications including adjustable refractive index and controllable birefringence, low optical losses, low optical absorbance, increased solvent resistance, and high thermal stability. A method for adjusting the refractive index to make useful copolyimide core/cladding waveguide structures by controlling the 6FDA/BPDA ratio.

Polymide optical waveguide structures

A chemical resistant copolymer useful in electronic applications, said copolymer is a polyimide containing a 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moiety, at least one other dianhydride moiety, and at least one diamine.

Polyimide copolymers containing 3,3',4,4'-tetracarboxybiphenyl

A wet-etch composition for polyamic acids and partially cured polyamic acids comprising an aqueous solution having a major portion of water, a substituted hydrocarbon solvent and a non-ionic base that is strong enough to deprotonate the polyamic acid or a partially cured polyamic acid in a weight ratio of 0.1-49:49-0.1, with the proviso that the composition contains less than 1.0 percent ionic base. The present invention further provides a process for wet-etching polyamic acids or partially cured polyamic acids.

Wet-etch process and composition

A group of polyimides and copolyimides made from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) or 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride (IPAN) their acid or ester forms and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.

Low dielectric constant, low moisture uptake polyimides and copolyimides

A group of polyimides and copolyimides made from 6FDA, IPAN, or their acid or ester forms, and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.

A process for preparing 1,1,1,3,3,3-hexafluoro-2,2-di(3,4-dicarboxyphenyl) propane anhydride is disclosed. 1,1,1,3,3,3-hexafluoro-2,2-di(3,4 -dimethylphenyl) propane is oxidized under liquid phase conditions in the presence of an oxygen-containing gas, bromine and heavy metal catalyst components to 1,1,1,3,3,3-hexafluoro-2,2-di(3,4-dicarboxyphenyl) propane in high yield. Addition of an anhydride of a low molecular weight carboxylic acid to the oxidation reaction mixture converts the 1,1,1-hexafluoro-2,2-di(3,4-dicarboxyphenyl)propane to 1,1,1,3,3,3-hexafluoro-2,2-di(3,4-dicarboxyphenyl) propane anhydride.

Preparation of 1,1,1,3,3,3-hexafluoro-2,2-Di(3,4-dicarboxyphenyl)propane

A wet-etch composition for polyamic acids and partially cured polyamic acids containing an aqueous solution having a major portion of water, a substituted hydrocarbon solvent and a non-ionic base that is strong enough to deprotonate the polyamic acid or a partially cured polyamic acid in a weight ratio of 0.1-49:49-0.1, with the proviso that the composition contains less than 1.0 percent ionic base. The present invention further provides a process for wet-etching polyamic acids or partially cured polyamic acids.

A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula ##STR1## wherein R.sub.1 and R.sub.2 are independently a hydrogen, a C.sub.1 to C.sub.6 alkyl moiety, or a ##STR2## R.sub.5 is a C.sub.1 to C.sub.6 alkyl moiety; and R.sub.3 and R.sub.4 are independently hydrogen or a C.sub.1 to C.sub.6 alkyl moiety, and curing the resulting coated substrate.

Process for making thick multilayers of polyimide

Polyimides useful in multilayer electronic devices containing the 4,4'-bis(4-amino-2-trifluoromethylphenoxy) biphenyl moiety have low dielectric constants, low moisture uptake, high thermal degradation stability, low glass transition temperature.

Polyimide containing 4,4'-bis(4-amino-2-trifluoromethylphenoxy)-biphenyl

Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

Polyamide, polyimide, and polyamide-imide polymers and copolymers using

Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

Polyamide, polyimide, and polyamide-imide polymers of

Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamono-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

Polyamide from diamino-t-butylbenzene

Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butyltoluene are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butyltoluene which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

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Naperville, IL, United States of America

Douglas E Fjare