Honeywell International Inc.

Alliedsignal Inc.

Douglas Campbell MacGugan

Mark W Weber

Dang Tu Van-Cao

Marie Annette Cox

Systems and methods for improving MEMS gyroscope start time are provided. In one embodiment, a circuit board for a MEMS gyroscope system comprises: a proof mass assembly; a proof mass control loop coupled to the proof mass assembly by a first proof mass motion sensor pickup line and a second proof mass motion sensor pickup line, where the proof mass control loop generates a set of drive signals that operate the proof mass assembly using a first capacitive signal from the first proof mass motion sensor pickup line and a second capacitive signal from the second proof mass motion sensor pickup line; and a tunable capacitive coupler connected to at least one of the first or the second proof mass motion sensor pickup lines, where the tunable capacitive coupler varies at least one of the first and second charge signals as a function of the drive signals.

Systems and methods for improving MEMS gyroscope start time

A ceramic L-shaped or T-shaped packaging apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor die that translates the sensor sense axis perpendicular to the normal input plane for direct attachment to a system-level printed circuit board (PCB).

Miniature package for translation of sensor sense axis

An apparatus for mechanically mounting one or more Micro Electro-Mechanical System (MEMS) sensors on a stable, structurally sound base, the base being a generally cubical block formed in a ceramic substrate having a plurality of substantially planar and mutually orthogonal surfaces, wherein a first one of the surfaces is structured for rotationally interfacing with a host structure that is to be monitored; one or more of the remaining surfaces is structured for mechanically mounting of a MEMS sensor; and a plurality of electrical signal carriers communicate between each of the MEMS sensor mounting surfaces and a plurality of electrical interface contacts positioned on the interfacing surface.

Miniature 3-dimensional package for MEMS sensors

A multi-channel synchronous voltage-to-frequency converter (SVFC) realized in an integrated semiconductor circuit. The multi-channel SVFC having an operational amplifier adapted to receive an analog data signal to be converted and a reset signal, the operational amplifier integrating the sum of the analog signal and the reset signal and generating an output signal as a function of the integrated sum; a comparator coupled to receive the integrated sum and a reference level signal, the comparator outputting a logic level signal as a function of the received reference level signal; a digital logic circuit in response to an external clock signal, the digital logic circuit receiving the logic level signal and generating a reset control signal and a frequency output pulse as a function of the logic level signal; and a reset source switch receiving the reset control signal and outputting the reset signal.

Multi-channel precision synchronous voltage-to-frequency converter

A well drilling system with a miniature directional indication sensor capable of operating at elevated temperature. The present invention is implemented with power supply, sensor drive and sense circuits in thick film or multi-chip module electronic assemblies, mounted on a chassis with a high resonant frequency. The thick film or multi-chip module electronics assemblies also contribute to increased shock and vibration resistance. Sensor drive and sense functions may be implemented in one or more application specific integrated circuits and integrated with multi-chip module electronics assembly. Analog-to-digital conversion of sensor signals is implemented in a voltage-to-digital converter circuit provided by the present invention. Furthermore, the present invention eliminates data lag between channels by providing simultaneous sampling of all the sensor channels.

Miniature directional indication instrument

A miniature directional indication sensor system capable of operating at elevated temperature. A directional indication sensor system is less than 1 inch in diameter and 7 inches in length. The directional sensor system provides angle measurement in applications from which current larger directional sensors are barred. The present invention provides increased shock and vibration resistance. The chassis of the present invention has an high resonant frequency, or &ldquo;Q&rdquo;. The present invention is implemented with power supply, sensor drive and sense circuits in thick film or multi-chip module electronic assemblies. The thick film or multi-chip module electronics assemblies also contribute to the increased shock and vibration resistance. Sensor drive and sense functions may be implemented in one or more application specific integrated circuits and integrated with multi-chip module electronics assembly. Analog-to-digital conversion of sensor signals is implemented in a voltage-to-frequency converter circuit provided by the present invention. Furthermore, the present invention eliminates data lag between channels by providing simultaneous sampling of all the sensor channels.

An integrated sensor package formed using low temperature co-fired ceramic assembly techniques and method for manufacturing same.

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Bellevue, WA, United States of America

Douglas Campbell MacGugan