University of Notre Dame Du Lac

Other

Indiana Integrated Circuits, LLC

Douglas C Hall

Gary H Bernstein

Jason M Kulick

Scott Howard

Anthony Hoffman

Mingjun Huang

Charles R Schroeder

First, second, and third integrated devices each include one or more interconnecting structure. Each interconnecting structure includes (i) one or more interconnecting nodules extending from an edge surface of the device, (ii) one or more interconnect voids formed in an edge surface of the device, or (iii) both (i) and (ii). The one or more interconnecting structures on each of the first and second device is mated with the one or more interconnecting structures on the second device. The first integrated device includes a signal output, the third integrated device includes a signal input; and the second integrated device includes a conductor for conducting a signal from the signal output to the signal input.

Inter-chip alignment

First and second integrated devices each have an optical component and a plurality of interconnect structures disposed one edge thereon. The first edge surface of the second integrated device is positioned contiguous to the first edge surface of the first integrated device. The interconnect structures disposed on the first integrated device are in physical contact with the interconnect structures disposed on the edge surface of the second integrated device so as to provide alignment for conveying at least one signal between the optical components on the first and second integrated devices.

Quilt packaging system with mated metal interconnect nodules and voids

Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment

Disclosed is a method of doping an oxide. The example method includes forming at least one of an AlGaAs oxide or an InAlP oxide on a GaAs substrate, and incorporating Erbium into the at least one AlGaAs oxide or InAlP oxide via ion implantation to form an Erbium-doped oxide layer. The example method also includes annealing the substrate and the at least one AlGaAs oxide or InAlP oxide.

Monolithically-pumped erbium-doped waveguide amplifiers and lasers

A dispensing package for containing a plurality of individual dosages of pills, capsules, tablets and the like that can be selectively removed one dose at a time. A cover portion for the package is made up of an outer layer of paperboard or the like with an inner layer of rupturable metal foil or the like bonded to one surface. Disc-shaped punch-out lids are cut into the paperboard layer and are held in position by the foil. A container portion is bonded to the foil and includes a sheet of flexible plastic material formed with a plurality of pockets or blisters. One of the lids overlies each of the pockets and a single dose of pills or the like is contained in each of the pockets. The paperboard layer has high strength and stiffness relative to the foil. Consequently, by collapsing one of the pockets against the cover portion, the portion of the foil attached to the associated lid ruptures and separates from the cover portion with the lid so that the pill is pressed through the opening uncovered by the lid.

Growing community of inventors

South Bend, IN, United States of America

Douglas C Hall