Qualcomm Incorporated

Douglas Bruce White

Chong Ding

Yu Zhang

Carl Christopher Hanke

Richard LaBarbera

Stephen Douglas Weitzel

Disclosed is a printed circuit board (PCB) including a set of stacked metallization layers separated by a set of stacked electrical-insulating layers, respectively, wherein the set of stacked metallization layers includes top metallization layer, bottom metallization layer, and intermediate metallization layer; a via electrically coupled to the top metallization layer, the intermediate metallization layer, and the bottom metallization layer, wherein the top metallization layer, a portion of the via between the top metallization layer and the intermediate metallization layer, and the intermediate metallization layer are configured to route a data signal between a signal-in and a signal-out; and an electromagnetic absorbing material configured to reduce an intensity of a reflected signal resulting from the data signal propagating downward along a stub of the via and reflecting off the bottom metallization layer. The electromagnetic absorbing material may be attached to a bottom of the PCB and/or coaxially attached to the stub.

Printed circuit board (PCB) with stubs coupled to electromagnetic absorbing material

According to certain aspects of the present disclosure, a semiconductor die includes a decoupling capacitor between a first interconnect metal layer and a second interconnect metal layer of the die, a first supply rail formed from the second interconnect metal layer, and a resistive metal path coupled between the decoupling capacitor and the first supply rail. The decoupling capacitor may be a metal-insulator-metal (MIM) capacitor. In some embodiments, the resistive metal path includes a plurality of elongated segments, and one or more connecting segments, wherein each of the one or more connecting segments electrically couples a respective pair of the plurality of elongated segments. In some embodiments, the resistive metal path includes multiple vias coupled in series.

Lossy MIM capacitor for on-die noise reduction

An apparatus includes a memory module socket having a base end and a branching point. The base end is coupled to a printed circuit board (PCB). The branching point is external to the PCB. A first branch extends from the branching point at an angle &#x3b8;, where 90 degrees&#x2266;&#x3b8;&#x3c;180 degrees, and a second branch extends from the branching point at an angle &#x3b8;, where 90 degrees&#x2266;&#x3b8;&#x3c;180 degrees. A method includes signaling between the PCB and a first memory module and a second memory module via a base end of the memory module socket. The memory module socket connects to the PCB via the base end. The signaling is branched at a branching point of the memory module socket to the first memory module via a first branch and to the second memory module via a second branch. The branching is external to the PCB.

Growing community of inventors

Raleigh, NC, United States of America

Douglas Bruce White