Other

Lucent Technologies Inc.

At+t Corp.

Douglas B Johnson

Dennis L Krause

Ajibola O Ibidunni

Trac Nguyen

Aaron L Frank

An ultrasonic liquefaction endodontic system having a graspable hand piece includes a contra-angle tip assembly that has an insert and an internal fluid flow passageway. A portion of the fluid flow passageway passes through a C-shaped receiver located at the end of the receiver so that an ultrasonic frequency may pass directly to the fluid flowing through the passageway. The fluid flow passageway may be an injection tube and the tubular body portion of the tip assembly may be injection molded around the injection tube and the insert. A supply tube, which is held in position by tube guides connected to the hand piece, provides a source of flushing fluid with and without pulsed pressure. The fluid pressure pulses may have an ultrasonic energy superimposed thereon as the fluid is forced into a root canal.

Endodontic procedure employing simultaneous liquefaction and acoustic debridement

Endodontic procedure employing simultaneous liquefaction and acoustic debridgement

Multilayer circuit devices include a plurality of metallized patterns thereon, said patterns being separated by a polymeric dielectric film. The various metallized patterns are interconnected by means of microvias through the polymeric film or films. Each of the metallizations is a composite including in succession from the substrate or from the polymeric film, a layer of titanium (Ti), a layer of titanium and palladium alloy (Ti/Pd), a layer of copper (Cu), and a layer of titanium and palladium alloy (Ti/Pd). The Ti-Ti/Pd-Cu-Ti/Pd composite is hereinafter referred to as TCT. The adhesion between the polymeric film and the top Ti/Pd layer is better than that between the polymer and gold (Au) and comparable to that between the polymer and an adhesion promoted Au layer. Use of the TCT metallization also results in additional cost reduction due to the elimination of Ni and Au layers on top of the Cu layer.

Metallization for polymer-dielectric multichip modules

Multilayer circuit devices include a plurality of metallized patterns thereon, said patterns being separated by a polymeric dielectric film. The various metallized patterns are interconnected by means of microvias through the polymeric film or films. Each of the metallizations is a composite including in succession from the substrate or from the polymeric film, a layer of titanium (Ti), a layer of titanium and palladium alloy (Ti/Pd), a layer of copper (Cu), and a layer of titanium and palladium alloy (Ti/Pd). The Ti--Ti/Pd--Cu--Ti/Pd composite is hereinafter referred to as TCT. The adhesion between the polymeric film and the top Ti/Pd layer is better than that between the polymer and gold (Au) and comparable to that between the polymer and an adhesion promoted Au layer. Use of the TCT metallization also results in additional cost reduction due to the elimination of Ni and Au layers on top of the Cu layer.

Metallization for polymer-dielectric multichip modules including a Ti/Pd

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Hampstead, NH, United States of America

Douglas B Johnson