The Boeing Company

Douglas Allan Pietila

Julio A Navarro

Jimmy Susumu Takeuchi

Michael De La Chapelle

Robert Tilman Worl

Ming Chen

David Lee Mohoric

Peter Timothy Heisen

Dietrich E Riemer

David N Rasmussen

Anthony D Monk

Scott A Raby

Bruce Larry Blaser

Embodiments described herein provide for integrating a transmit phased-array (Tx) antenna and a receive phased-array (Rx) antenna onto an electrically-conductive plate that forms a ground plane. The plate includes groves that operate as an RF choke. The RF choke mitigates the energy coupling between the Tx antenna and the Rx antenna. Spatial features of the grooves are selected based on a scan angle of at least one of the Tx antenna and the Rx antenna. Due to the electronic scanning performed by the Tx antenna and the Rx antenna, the energy coupling between the Tx antenna and the Rx antenna dynamically varies and may depend upon the relative scan angles between main beams of the antennas. The energy coupling may also depend upon the side lobe energy pattern of the Tx antenna, which varies based on the scan angle of the Tx antenna.

Radio frequency chokes for integrated phased-array antennas

Systems and methods according to one or more embodiments are provided for a scalable planar phased array antenna subarray tile assembly. A scalable phased array antenna subarray tile assembly is implemented as a printed wiring board (PWB) with antenna elements coupled to the PWB. In one example, a PWB includes integrated circuit die attached directly to a first surface of the PWB and couple to antenna elements coupled on a second surface of the PWB. First conductive vias extend through a first subset of PWB layers and couple to the integrated circuit die. Second conductive vias, larger than the first, extend through a second subset of PWB layers and couple to the antenna elements. A conductive trace couples the first and second conductive vias on a PWB layer. The second conductive vias are offset from the first to provide a thermal mechanical stress relief to the integrated circuit die.

Scalable planar packaging architecture for actively scanned phased array antenna system

A phased array antenna for a mobile platform combines transmit and receive antennas within a common, low profile enclosure. Transmit and receive functions, a power supply, up and down frequency converters, and an antenna controller are integrated into closely packaged layers within the enclosure.

Integrated low profile phased array antenna system

A method and apparatus for creating an antenna system. A configuration for a plurality of antenna cells is selected for an antenna in the antenna system. Each antenna cell in the plurality of antenna cells comprises a plurality of antenna elements having a symmetric arrangement. A portion of antenna elements in the plurality of antenna elements for each antenna cell in the plurality of antenna cells on a substrate is selected to transmit electromagnetic waves.

Phased array antenna using identical antenna cells

A multi-channel circulator or isolator well suited for use in phased array antennas or other RF devices where space and packaging constraints make the implementation of a conventional circular or isolator difficult or impossible. The multi-channel circulator/isolator can be configured as an isolator by the inclusion of one or more load resistors at one of its ports. In various configurations two or more ferrite substrates are provided that each provide a plurality of transmission ports. One or more permanent magnets are used to simultaneously provide the magnetic flux field through both of the substrates. The substrates can be configured such that they are spaced apart by a small distance, or positioned face to face in contact with one another. One or a plurality of magnets can be used depending upon RF requirements. Each substrate forms an independent electromagnetic wave propagation channel that limits the propagation of RF energy between its ports in one direction only.

Multi-channel circulator/isolator apparatus and method

A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.

Method and system for angled RF connection using a flexible substrate

An integrated ceramic chip carrier module for a phased array antenna. The module is comprised of a plurality of layers of low temperature, co-fired ceramic formed into an integrated module. The module combines the injection molded probes, button layer and holder, and the ceramic chip carrier into a single integrated component part. This construction provides for improved performance, reliability, manufacturing repeatability, and lower overall antenna manufacturing costs.

Antenna integrated ceramic chip carrier for a phased array antenna

An electronically steerable phased array antenna module having a conformable circuit element. The conformable circuit element forms a packaging architecture which includes a flexible substrate on which the control electronics of the antenna can be mounted directly or electrically coupled to the flexible substrate. The radiating elements are integrally formed on the substrate together with monolithic transmission lines which couple the radiating elements to the integrated circuits forming the control electronics. In one preferred embodiment, integrated power combiner/splitters may be integrally formed on the conformable circuit element and integrated transmission feed lines are formed on the circuit element coupling the power combiner/splitter circuits to the control electronics. The conformable circuit element provides a packaging architecture which enables a large plurality of antenna radiating elements and associated interconnecting transmission and feed to be packaged in a cost efficient and compact manner, and which can be easily adapted for a variety of different forms of phased array antennas.

Growing community of inventors

Puyallup, WA, United States of America

Douglas Allan Pietila