International Business Machines Corporation

Douglas A Baska

James D Bielick

Daniel Mark Dreps

Darryl John Becker

Roger Donell Weekly

Phillip Duane Isaacs

Rohan U Mandrekar

Michael Lynn Zumbrunnen

Gerald Keith Bartley

Matthew Allen Butterbaugh

Sukhvinder Singh Kang

Gerald J Fahr

Mark Kenneth Hoffmeyer

Paul Eric Dahlen

Robert Allen Drehmel

James Anthony Marcella

Wayne Melvin Barrett

William P Kostenko

Mitchell Zapotoski

Joseph P Corrado

Kevin R Qualters

Frank E Bosco

Kenneth Claude Hinz

Wesley H Bachman

Brian Scott Mullenbach

Kenneth Edward Lubahn

Some embodiments of the inventive subject matter are directed to forming, on a first circuit board, first pins that connect to first leads of a first electronic component; forming, on the first circuit board, second pins that connect to second leads of a second electronic component; affixing the first circuit board to a second circuit board having a first layer with first wires; and forming second wires on a second layer of the second circuit board, wherein said forming the second wires creates an electrical connection on the second circuit board between a portion of the first pins and a portion of the second pins. In some embodiments, the second circuit board is smaller than the first circuit board, and the second layer of the second circuit board is, in length, approximately equivalent to a distance between the first electronic component and the second electronic component.

Implementing high-speed signaling via dedicated printed circuit-board media

Some embodiments of the inventive subject matter are directed to a first circuit board configured to include an electronic component. The electronic component includes a plurality of leads. The first circuit board includes first wires configured to connect to a first portion of the plurality of leads. The second circuit board is affixed to the first circuit board. The second circuit board includes second wires. The second circuit board is smaller in size than the first circuit board. A plurality of electrical connectors extend through a thickness of the first circuit board and are configured to connect a second portion of the plurality of leads to the second wires.

A data processing system and method providing a jumper which provides standby power from a redundant power supply to one of at least two critical functions in a frame having bays for holding at least two nodes. The redundant power supply supplying power to one of the nodes in the frame and one of the critical functions. A jumper is slidably engageable in the frame in place of one of the nodes. The jumper, when engaged in the frame, transfers power from the redundant power supply to the other of the critical functions. The jumper is included in a jumper book of an airblock which includes passive airblock books. Mechanical keys on the passive airblock books prevent the removal of the jumper book until after the passive airblock books are removed.

Fail safe redundant power supply in a multi-node computer system

A memory unit includes a system memory controller coupled to a plurality of memory clock oscillators and a plurality of respective voltage controllers, wherein each memory clock oscillator and respective voltage controller are coupled to a memory receptacle and thus provide a plurality of memory receptacles, each receptacle in the plurality of receptacles having a separate power boundary for operation of a memory type. The memory unit provides a computing system with capabilities to operate a variety of memory types. Methods and computer program products of operation of the memory unit are provided.

Increased performance using mixed memory types

An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

A data transfer method and apparatus are provided for transferring data in a computer system on a high-speed synchronous multi-drop bus. Multiple devices including at least a first group of a plurality of devices and a second group of at least one device are connected to the high-speed synchronous multi-drop bus. To transfer data between devices in the first group, a first unidirectional data valid signal is applied to each device in the second group. The data from a sending device in the first group is transferred to a designated device in the second group. A second unidirectional data valid signal is applied to each device in the first group. The data is transferred from the designated device in the second group to a selected device in the first group.

Method and apparatus for transferring data on a synchronous multi-drop

Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC modules or banks of IC modules that are interconnected to a printed circuit card. A mechanically compliant, thermally conductive adhesive is used to join the heatsinks to the modules. An oxide formed on the release layer readily bonds with the thermally conductive adhesive. In the event that heatsinks need to be removed to repair or rework the modules, local heat may be applied to melt the release layer to remove a heatsink without need for use of significant applied torque and normal forces. Because the release layer has a low melting point that affords easy separation from the adhesive layer, both component delaminations and the partial reflow or melting of solder joints on adjacent components are eliminated from the heatsink removal process.

Heatsink and package structures with fusible release layer

A computer arrangement includes an electronics enclosure located within a computer housing, which is divided into a plurality of physically separated cooling zones. The enclosure has a plurality of inlet and outlet openings. Each cooling zone is in registration with respective inlet and outlet openings. A backplane is disposed within the electronics enclosure, and has front and rear surfaces. A first electrical component is attached to one of the surfaces and is arranged in one of the cooling zones. At least one circuit board is disposed within the electronics enclosure and is attached to the front surface of the backplane. The circuit board has a second electrical component attached to a surface thereof, which is arranged in another one of the cooling zones. A system operation card is disposed within the electronics enclosure, and is attached to the rear surface of the backplane. A gas moving device is located outside of the electronics enclosure, and is activatable to cause a cooling gas to flow through the cooling zones. The inlet and outlet openings are sized so that the cooling zones receive only an amount of cooling gas necessary to cool the respective electrical components located therein.

Enhanced circuit board arrangement for a computer

Heat dissipation apparatus and method for attaching a heat dissipation

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Pine Island, MN, United States of America

Douglas A Baska