Microsoft Technology Licensing, LLC

Apple Inc.

Doug Heirich

Michael Nikkhoo

Roy Joseph Riccomini

Michael Beerman

Maosheng Ye

Vinh H Diep

Chiew-Siang Goh

Andrew Bart Hodge

Andrew Bert Hodge

Cesar Lozano Villarreal

Alexander Michael Kwan

Joseph Daniel Taylor

A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.

Flexible thermal conduit for an electronic device

Heat dissipation structure for an electronic device

An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

Electronic device enclosures and heatsink structures with thermal management features

Growing community of inventors

Palo Alto, CA, United States of America

Doug Heirich